Abstract: The present invention provides methods for determining mild aqueous laundry detergent formulations, mild liquid laundry detergent formulations, and methods for preparing the same. The formulations comprise various surfactants and have a low detergent mildness indicator, derived from combining results from Zein test, corneosurfametry test, and in vitro cytokine release test.

Abstract: A disinfectant wipe and disinfectant composition which exhibits exceptional antimicrobial activities as a result of the synergistic combination of a quaternary ammonium salts and 1,2-alkandiol is provided. The wipe is pre-impregnated with a disinfectant composition which comprises a quaternary ammonium salt, a 1,2-alkanediol with 5-10 carbon atoms, a glycol ether, a surfactant, a pH regulating agent, and water, and optionally alcohol. A method of preparation and a process for disinfecting a surface with the wipe composition are also provided.

Abstract: A disinfectant wipe and disinfectant composition which exhibits exceptional antimicrobial activities as a result of the synergistic combination of a quaternary ammonium salts and 1,2-alkandiol is provided. The wipe is preimpregnated with a disinfectant composition which comprises a quaternary ammonium salt, a 1,2-alkanediol with 5-10 carbon atoms, a glycol ether, a surfactant, a pH regulating agent, and water, and optionally alcohol. A method of preparation and a process for disinfecting a surface with the wipe composition are also provided.

Abstract: The present invention is directed to a liquid detergent composition, comprising from about 5 wt % to about 45 wt % of a surfactant, about 0.01 wt % to about 1 wt % of an external structuring agent which is a parenchymal cellulose material, and about 0.1 wt % to about 10 wt % of a builder component. The present invention is also directed to methods of preparing the liquid detergent compositions. The present invention is directed to a fragrance composition, comprising about 10 to about 75 wt % of a fragrance component and about 0.01 wt % to about 1 wt % of an external structuring agent.

Abstract: The present invention is directed to a composition comprising about 0.01 wt % to about 0.5 wt % of a clay, and about 0.01 wt % to about 0.5 wt % of an external structuring agent which is a parenchymal cellulose material; the present invention is also directed to a liquid detergent composition, comprising from about 5 wt % to about 45 wt % of a surfactant, about 0.01 wt % to about 0.5 wt % of a clay, about 0.01 wt % to about 0.5 wt % of an external structuring agent which is a parenchymal cellulose material, and about 0.1 wt % to about 10 wt % of a builder component; and the present invention is further directed to methods of preparing the liquid detergent compositions; and the present invention is moreover directed to a fragrance composition, comprising about 0.1 wt % to about 10 wt % of an encapsulated fragrance component, about 0.01 wt % to about 0.5 wt % of a clay, and about 0.01 wt % to about 0.5 wt % of an external structuring agent.

Abstract: The present disclosure provides sulfate-free detergent formulations comprising water, a nonionic surfactant, and at least a second surfactant, wherein the formulation has a Zein score of less than about 3 percent when tested as a 10% dilution.

Abstract: The present invention is directed to a liquid detergent composition, comprising from about 5 wt % to about 45 wt % of a surfactant, about 0.01 wt % to about 1 wt % of an external structuring agent which is a parenchymal cellulose material, and about 0.1 wt % to about 10 wt % of a builder component. The present invention is also directed to methods of preparing the liquid detergent compositions. The present invention is directed to a fragrance composition, comprising about 10 to about 75 wt % of a fragrance component and about 0.01 wt % to about 1 wt % of an external structuring agent.

Abstract: A disinfectant wipe and disinfectant composition which exhibits exceptional antimicrobial activities as a result of the synergistic combination of a quaternary ammonium salts and 1,2-alkandiol is provided. The wipe is pre-impregnated with a disinfectant composition which comprises a quaternary ammonium salt, a 1,2-alkanediol with 5-10 carbon atoms, a glycol ether, a surfactant, a pH regulating agent, and water, and optionally alcohol. A method of preparation and a process for disinfecting a surface with the wipe composition are also provided.

Abstract: A nonwoven absorbent wipe is impregnated with an antibacterial and antimicrobial composition comprising quaternary ammonium salts, glycol ethers, a surfactant and water. A method of preparation and a process for disinfecting hard surfaces with the wipe are provided.

Abstract: The present invention is directed to a sprayable, acidic hard surface cleaning and/or disinfecting composition which contains suspended inclusions which appear as visibly discernible, discrete particulate materials, preferably where said discrete particulate materials are based on alginates which are present as two or more classes of particulate materials.

Abstract: The present invention is directed to a sprayable, acidic hard surface cleaning and/or disinfecting composition which contains suspended inclusions which appear as visibly discernible, discrete particulate materials, preferably where said discrete particulate materials are based on alginates.

Abstract: The present invention is directed to a sprayable, acidic hard surface cleaning and/or disinfecting composition which contains suspended inclusions which appear as visibly discernible, discrete particulate materials, preferably where said discrete particulate materials are based on alginates.

Abstract: Semiconductor wafer coating system calibration structures and methods are described. In one embodiment, a calibration structure includes a perimetral edge bounding a calibration body. A calibration edge is spaced from the perimetral edge and is positioned over the calibration body. Together, the edges define a distance therebetween which is configured to calibrate a wafer coating system. In a preferred embodiment, the edges define respective termination distances configured to calibrate multiple different wafer coating systems. In another embodiment, a calibration pattern is formed over a semiconductor wafer. A layer of material is formed over the calibration pattern by a coating system, and selected portions thereof removed by the system. The positions of unremoved portions of the layer of material are inspected relative to the calibration pattern to ascertain whether the coating system removed the selected portions within desired tolerances.

Abstract: Semiconductor wafer coating system calibration structures and methods are described. In one embodiment, a calibration structure includes a perimetral edge bounding a calibration body. A calibration edge is spaced from the perimetral edge and is positioned over the calibration body. Together, the edges define a distance therebetween which is configured to calibrate a wafer coating system. In a preferred embodiment, the edges define respective termination distances configured to calibrate multiple different wafer coating systems. In another embodiment, a calibration pattern is formed over a semiconductor wafer. A layer of material is formed over the calibration pattern by a coating system, and selected portions thereof removed by the system. The positions of unremoved portions of the layer of material are inspected relative to the calibration pattern to ascertain whether the coating system removed the selected portions within desired tolerances.

Abstract: Semiconductor wafer coating system calibration structures and methods are described. In one embodiment, a calibration structure includes a perimetral edge bounding a calibration body. A calibration edge is spaced from the perimetral edge and is positioned over the calibration body. Together, the edges define a distance therebetween which is configured to calibrate a wafer coating system. In a preferred embodiment, the edges define respective termination distances configured to calibrate multiple different wafer coating systems. In another embodiment, a calibration pattern is formed over a semiconductor wafer. A layer of material is formed over the calibration pattern by a coating system, and selected portions thereof removed by the system. The positions of unremoved portions of the layer of material are inspected relative to the calibration pattern to ascertain whether the coating system removed the selected portions within desired tolerances.