Patents by Inventor Lisa Owen
Lisa Owen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932575Abstract: A tinted glass composition and glass article including the same, the composition including: about 45 mol % to about 80 mol % SiO2; about 6 mol % to about 22 mol % Al2O3; 0 mol % to about 25 mol % B2O3; about 7 mol % to about 25 mol % of at least one alkaline earth oxide selected from MgO, CaO, SrO, BaO, and combinations thereof, about 0.5 mol % to about 20 mol % CuO; 0 mol % to about 6 mol % SnO2, SnO, or a combination thereof, 0 mol % to about 1.0 mol % C; 0 mol % to about 5 mol % La2O3; and 0 mol % to about 10 mol % PbO, and that is substantially free of alkali metal.Type: GrantFiled: January 3, 2023Date of Patent: March 19, 2024Assignee: CORNING INCORPORATEDInventors: Heather Debra Boek, Timothy James Kiczenski, Lisa Anne Tietz Moore, Natesan Venkataraman, Mark Owen Weller
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Patent number: 8313602Abstract: Methods for manufacturing a protective helmet for the military and other uses are disclosed. Embodiments of the method include winding ballistic-tolerant tape or fibers to create a preform, placing the preform into a first mold member having an interior that defines a helmet-shaped cavity, and pressing together the first mold member against a second mold member that includes a pressurized bladder member. The method may further include pressurizing the bladder until the first and second mold members are heated and adhesives have melted or cured. The first and second mold members are cooled and the preform is removed from the first and second mold members.Type: GrantFiled: January 12, 2011Date of Patent: November 20, 2012Assignee: BAE Systems Aerospace & Defense Group Inc.Inventors: Brian H. Jones, Michael James McElroy, Valent Horvatich, Jeffrey A. Mears, Lisa Owen
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Publication number: 20120266744Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.Type: ApplicationFiled: June 15, 2011Publication date: October 25, 2012Inventors: Fielder Stanton Lyons, Kenneth C. Harding, Lisa Owen, Joseph Mitchell, Gene C. Weedon, Jeffrey A. Mears, Peter Anthony Russell
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Patent number: 8287987Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.Type: GrantFiled: June 15, 2011Date of Patent: October 16, 2012Assignee: BAE Systems Tensylon H.P.M., Inc.Inventors: Fielder Stanton Lyons, Kenneth C. Harding, Lisa Owen, Joseph Mitchell, Gene C. Weedon, Jeffrey A. Mears, Peter Anthony Russell
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Publication number: 20120175046Abstract: Methods for manufacturing a protective helmet for the military and other uses are disclosed. Embodiments of the method include winding ballistic-tolerant tape or fibers to create a preform, placing the preform into a first mold member having an interior that defines a helmet-shaped cavity, and pressing together the first mold member against a second mold member that includes a pressurized bladder member. The method may further include pressurizing the bladder until the first and second mold members are heated and adhesives have melted or cured. The first and second mold members are cooled and the preform is removed from the first and second mold members.Type: ApplicationFiled: January 12, 2011Publication date: July 12, 2012Inventors: Brian H. Jones, Michael James McElroy, Valent Horvatich, Jeffrey A. Mears, Lisa Owen
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Patent number: 8211342Abstract: A process for the production of a non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.Type: GrantFiled: July 8, 2011Date of Patent: July 3, 2012Assignee: Bae Systems Tensylon H.P.M., Inc.Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
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Patent number: 8075979Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.Type: GrantFiled: July 8, 2011Date of Patent: December 13, 2011Assignee: BAE System Tensylon H.P.M., Inc.Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
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Publication number: 20110272848Abstract: A process for the production of a non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.Type: ApplicationFiled: July 8, 2011Publication date: November 10, 2011Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
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Publication number: 20110274904Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.Type: ApplicationFiled: July 8, 2011Publication date: November 10, 2011Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
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Publication number: 20110167998Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.Type: ApplicationFiled: July 30, 2007Publication date: July 14, 2011Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell
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Patent number: 7976932Abstract: A ballistic resistant panel including a strike face portion and a backing portion. The strike face portion includes a plurality of interleaved layers of non-fibrous ultra high molecular weight polyethylene tape. The backing portion includes a plurality of interleaved layers of cross-plied fibers of ultra high molecular weight polyethylene. The entire stack of interleaved layers is compressed at high temperature and pressure to form a ballistic resistant panel having a strike face on one side. It has been found that ballistic resistance increases as the weight ratio of the strike face portion with respect to the backing portion decreases. A composite panel having a strike face Tensylon tape with at most 40% of the total weight of the panel exhibits improved ballistic resistance properties as compared to a monolithic structure of strictly interleaved layers of cross-plied high modulus fibers.Type: GrantFiled: May 29, 2009Date of Patent: July 12, 2011Assignee: BAE Systems Tensylon H.P.M, Inc.Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell, Erik Johnson
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Patent number: 7976930Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.Type: GrantFiled: June 25, 2007Date of Patent: July 12, 2011Assignee: BAE Systems Tensylon H.P.M., Inc.Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
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Patent number: 7972679Abstract: A ballistic-resistant molded article having a sandwich-type structure including two outer portions of a first high modulus material surrounding an inner portion of a second high modulus material. The outer portions are comprised of a plurality of interleaved layers of adhesive coated cross-plied non-fibrous ultra high molecular weight polyethylene tape. The inner portion is comprised of a plurality of interleaved layers of high modulus cross-plied fibers embedded in resin. The stack of interleaved layers is compressed at high temperature and pressure to form a hybrid sandwich ballistic-resistant molded article that includes a mix of high modulus materials. It has been found that ballistic resistance is higher for the hybrid structure than for a monolithic structure of comparable areal density.Type: GrantFiled: November 20, 2009Date of Patent: July 5, 2011Assignee: BAE Systems Tensylon H.P.M., Inc.Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell, Erik Johnson
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Patent number: 7964266Abstract: A wide sheet of highly oriented ultra high molecular weight polyethylene comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint. A continuous method for the production of such materials comprising subjecting longitudinally overlapping or abutted strips of these materials to temperatures below the melting point of the UHMWPE and pressures over 300 pli is also disclosed.Type: GrantFiled: April 13, 2007Date of Patent: June 21, 2011Assignee: BAE Systems Tensylon H.P.M., Inc.Inventors: Kenneth C. Harding, Gene C. Weedon, Lisa Owen
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Patent number: 7964267Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.Type: GrantFiled: July 30, 2007Date of Patent: June 21, 2011Assignee: BAE Systems Tensylon H.P.M., Inc.Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell
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Patent number: 7923094Abstract: A non-woven ballistic material that demonstrates exceptional ballistic properties which ballistic material is fabricated by the lamination or angular lamination of a plurality of wide sheets of UHMWPE comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint.Type: GrantFiled: November 26, 2008Date of Patent: April 12, 2011Assignee: BAE Systems Tensylon High Performance Materials, Inc.Inventors: Kenneth C. Harding, Gene C. Weedon, Joe Mitchell, Lisa Owen
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Patent number: 7905971Abstract: A wide sheet of highly oriented ultra high molecular weight polyethylene comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint. A continuous method for the production of such materials comprising subjecting longitudinally overlapping or abutted strips of these materials to temperatures below the melting point of the UHMWPE and pressures over 300 pli is also disclosed.Type: GrantFiled: October 19, 2009Date of Patent: March 15, 2011Inventors: Kenneth C. Harding, Gene C. Weedon, Lisa Owen
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Publication number: 20100092729Abstract: A wide sheet of highly oriented ultra high molecular weight polyethylene comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint. A continuous method for the production of such materials comprising subjecting longitudinally overlapping or abutted strips of these materials to temperatures below the melting point of the UHMWPE and pressures over 300 pli is also disclosed.Type: ApplicationFiled: October 19, 2009Publication date: April 15, 2010Inventors: Kenneth C. Harding, Gene C. Weedon, Lisa Owen
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Publication number: 20080318016Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.Type: ApplicationFiled: June 25, 2007Publication date: December 25, 2008Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
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Publication number: 20080254260Abstract: A wide sheet of highly oriented ultra high molecular weight polyethylene comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint. A continuous method for the production of such materials comprising subjecting longitudinally overlapping or abutted strips of these materials to temperatures below the melting point of the UHMWPE and pressures over 300 pli is also disclosed.Type: ApplicationFiled: April 13, 2007Publication date: October 16, 2008Inventors: Kenneth C. Harding, Gene C. Weedon, Lisa Owen