Abstract: A modified polyimide composition having improved adhesion characteristic to a metal layer and articles obtained therefrom. A limited quantity of water is added to a halogenated polyamic acid to form a reaction product, which is then sprayed, degreased, oxidized and cured into a layer of the modified polyimide composition. The chemically modified surface is then electrolessly plated with a primary metal layer followed by one or more electrolessly or electrolytically applied secondary metal layers until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.

Abstract: Method of producing a polyimide layer having improved adhesion to a metal layer thereon. A halogenated polyamic acid is sprayed, partially cured, degreased and oxidized to form a partially cured polyimide layer, which is then electrolessly plated with a primary metal layer and then final cured into the polyimide layer. Electrolessly or electrolytically applied secondary metal layers are then deposited on the primary layer, until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.

Abstract: Method of producing a modified polyimide layer to improve adhesion of a metal layer thereon. A limited quantity of water is added to a halogenated polyamic acid to form a reaction product, which is then sprayed, degreased, oxidized and cured into a modified polyimide layer. The chemically modified surface by the aforementioned method is then electrolessly plated with a primary metal layer followed by one or more electrolessly or electrolytically applied secondary metal layers until the metal layer of a desired thickness is attained. The present invention further discloses articles such as an EMI shielded enclosure and an insulated mold surface, having metal layers as an EMI shield and an insulating surface, respectively.