Abstract: An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).

Abstract: A selective call receiver (900) includes a ceramic substrate (820) for conveying an electrical signal. The ceramic substrate (820) has at least one solder pad which includes a solder pad area (110) of an electrical conductor (120) on the ceramic substrate and a solder wettable layer (210). The electrical conductor (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad area (110). The solder wettable layer (210) includes at least 50% indium by weight. A circuit device (410) has at least one circuit terminal which is soldered to the at least one solder pad of the ceramic substrate (820) for electrical interconnection to another circuit device (410) in the selective call receiver (900).

Abstract: A solder pad for mechanically and electrically coupling solder terminals (420) of electronic devices (410) to a non-conductive ceramic substrate (130) includes a solder pad portion (110) of a conductive runner (120) and a solder wettable layer (210). The solder pad portion (110) of the conductive runner (120) is on the non-conductive ceramic substrate (130). The conductive runner (120) consists essentially of a conductive ceramic material. The solder wettable layer (210) is attached to the solder pad portion (110). The solder wettable layer (210) includes at least 50% indium by weight.