Patents by Inventor Lisa Yung

Lisa Yung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Steering tool
    Patent number: 7413034
    Abstract: A steering tool for use in drilling a borehole, including a tubular housing, a tool actuating device movably supported within the housing, a plurality of hydraulically actuated steering devices circumferentially spaced about the housing, and a hydraulic control system interposed between the tool actuating device and the steering devices for converting an actuating movement of the tool actuating device to independent actuation of the steering devices.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: August 19, 2008
    Assignee: Halliburton Energy Services, Inc.
    Inventors: Kennedy Kirkhope, Paul Rieder, Lisa Yung, Richard T. Hay, Gary M. Crase
  • Steering tool
    Publication number: 20070235227
    Abstract: A steering tool for use in drilling a borehole, including a tubular housing, a tool actuating device movably supported within the housing, a plurality of hydraulically actuated steering devices circumferentially spaced about the housing, and a hydraulic control system interposed between the tool actuating device and the steering devices for converting an actuating movement of the tool actuating device to independent actuation of the steering devices.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Applicant: Halliburton Energy Services, Inc.
    Inventors: Kennedy Kirkhope, Paul Rieder, Lisa Yung, Richard T. Hay, Gary M. Crase
  • Package warpage control
    Patent number: 7208342
    Abstract: A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.
    Type: Grant
    Filed: May 27, 2004
    Date of Patent: April 24, 2007
    Assignee: Intel Corporation
    Inventors: Michael Keat Lye Lee, Mun Leong Loke, Soon Chuan Ong, Hooi Jin Teng, Lisa Yung Hui Lee, Altaf Hasan