Patents by Inventor Lisheng Gao

Lisheng Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210041381
    Abstract: A Differential Scanning calorimetry (DSC) thermal analysis method for the action of an applied electric field includes: step 1, in an experiment module of a differential scanning calorimeter, placing a microelectrode crucible and a reference crucible on corresponding sensors, connecting electrode wires of the microelectrode crucible with a signal generator, setting signal parameters to be output, placing a tested sample in a gap between electrodes, closing a microelectrode crucible lid, and closing the experiment module; step 2, at a temperature-varying stage, measuring a DSC curve of the tested sample under the action of an electric field, and at a reheating stage, measuring a DSC curve of the tested sample with no electric field; and step 3, analyzing the DSC curves in combination with the related theories of dielectrics and thermodynamics, and calculating an electric field intensity of the tested sample and a phase transformation rate of the tested sample.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 11, 2021
    Inventors: Lisheng Zhong, Xiaoyuan Song, Jinghui Gao, Qinxue Yu
  • Publication number: 20210037812
    Abstract: A DSC (Differential Scanning calorimetry) electrode system capable of applying an electric field includes a differential scanning calorimeter, a computer, a signal generator, a self-pressurization liquid nitrogen tank and a reference crucible, wherein the self-pressurization liquid nitrogen tank is connected to the differential scanning calorimeter and used for controlling temperature in real time; the differential scanning calorimeter is connected to the computer and used for transmitting signals and recording experiment results. The DSC electrode system also includes a microelectrode crucible that includes a ceramic crucible, a ceramic crucible cover, welding spots, two electrodes and electrode wires, wherein the two electrodes are respectively fixed in the ceramic crucible; a gap is reserved between the electrodes and used for storing a tested sample; the welding spots are reserved at upper ends of the electrodes.
    Type: Application
    Filed: August 10, 2020
    Publication date: February 11, 2021
    Inventors: Lisheng Zhong, Xiaoyuan Song, Jinghui Gao, Qinxue Yu, Lin Liu, Jiaxi He, Yafei Li
  • Patent number: 10818005
    Abstract: Methods and systems for determining a layer on which a defect detected on a wafer is located are provided. One method includes detecting defects on a wafer by directing light to the wafer at first and second angles of incidence and determining locations of the defects on the wafer based on the output corresponding to the defects. For one of the defects detected in the output generated for one spot illuminated on the wafer with the light directed to the wafer at the first and second angles, the method includes comparing the locations of the one of the defects determined based on the output generated with the light directed to the one spot on the wafer at the first and second angles. The method further includes determining a layer of the wafer on which the one of the defects is located based on results of the comparing.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: October 27, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Jingshan Zhong, Bjorn Brauer, Lisheng Gao
  • Patent number: 10783673
    Abstract: Example methods and apparatus for generating a heatmap are described. One example method includes dividing a current display region of an original image on a screen into cells. The basic heat of a heat point region in each cell is calculated according to statistics and a heat weight for generating a heatmap this time, and diffusion heat to which each pixel in the current display region is subject is calculated according to the basic heat of the heat point region in the cell. The total heat of each pixel in the current display region is obtained, and a color corresponding to the total heat of each pixel in the current display region is presented in the current display region of the original image according to a preset heat presentation correspondence to obtain a heatmap of the current display region.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: September 22, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lisheng Gao, Bing Ni
  • Patent number: 10731265
    Abstract: The present invention relates to a spent fuel dry reprocessing method for directly obtaining a zirconium alloy nuclear fuel, comprising: determining components and a ratio of a molten salt composition used for melting a spent fuel according to a requirement of reactor design on a zirconium alloy fuel and contents of actinium series metals in the spent fuel; melting the spent fuel in the above molten salt composition; and selecting an electrode pair for electrodeposition so that zirconium in the molten salt composition and uranium ions in the spent fuel or uranium and other actinium series metal ions are subjected to co-deposition, thereby obtaining the zirconium alloy nuclear fuel meeting a design requirement. The spent fuel dry reprocessing method provided by the invention is suitable for oxide spent fuel and metal spent fuel, and is simple and controllable in process, low in energy consumption, low in cost and easy to industrialize.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: August 4, 2020
    Assignee: China Institute of Atomic Energy
    Inventors: Guoan Ye, Yinggen Ouyang, Changshui Wang, Lisheng Liu, Jianhua Guo, Ruixue Li, Li Chang, Shangwen Chang, He Yang, Wei Gao, Huibo Li, Songtao Xiao
  • Publication number: 20200240928
    Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Inventors: Eugene Shifrin, Bjorn Brauer, Sumit Sen, Ashok Mathew, Sreeram Chandrasekaran, Lisheng Gao
  • Patent number: 10648924
    Abstract: Methods and systems for generating a high resolution image for a specimen from one or more low resolution images of the specimen are provided. One system includes one or more computer subsystems configured for acquiring one or more low resolution images of a specimen. The system also includes one or more components executed by the one or more computer subsystems. The one or more components include a model that includes one or more first layers configured for generating a representation of the one or more low resolution images. The model also includes one or more second layers configured for generating a high resolution image of the specimen from the representation of the one or more low resolution images.
    Type: Grant
    Filed: January 2, 2017
    Date of Patent: May 12, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Jing Zhang, Grace Hsiu-Ling Chen, Kris Bhaskar, Keith Wells, Nan Bai, Ping Gu, Lisheng Gao
  • Patent number: 10648925
    Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: May 12, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Eugene Shifrin, Bjorn Brauer, Sumit Sen, Ashok Mathew, Sreeram Chandrasekaran, Lisheng Gao
  • Patent number: 10605744
    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: March 31, 2020
    Assignee: KLA-Tencor Corp.
    Inventors: Lu Chen, Jason Kirkwood, Mohan Mahadevan, James A. Smith, Lisheng Gao, Junqing (Jenny) Huang, Tao Luo, Richard Wallingford
  • Patent number: 10599944
    Abstract: The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to provide at least one visual representation of the test and reference images via the user interface to show effects of an inspection algorithm and/or difference filter.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: March 24, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Hucheng Lee, Junqing Huang, Lisheng Gao
  • Patent number: 10600177
    Abstract: Methods and systems are disclosed that provide nuisance reduction in images, such as semiconductor images that include one or more metal lines. A potential defect is correlated against pixel grey level intensity charts for two perpendicular axes. A position of the potential defect relative to a pattern, such as a metal line, is determined along the two axes. The potential defect can be classified as a defect of interest or nuisance event.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: March 24, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Bjorn Brauer, Junqing Huang, Lisheng Gao
  • Patent number: 10600175
    Abstract: Systems and methods of a two-pass inspection methodology that dynamically creates micro care areas for inspection of repeater defects. Micro care areas can be formed around each location of a repeater defect. After inspection, additional repeater defects in the micro care areas can be identified. Attributes of the repeater defects can be compared and any repeater defects with attributes that deviate from an expected group attribute distribution can be classified as nuisance.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: March 24, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Bjorn Brauer, Benjamin Murray, Shishir Suman, Lisheng Gao
  • Patent number: 10514685
    Abstract: Systems and methods for monitoring stability of a wafer inspection recipe over time are provided. One method includes collecting inspection results over time. The inspection results are generated by at least one wafer inspection tool while performing the wafer inspection recipe on wafers at different points in time. The method also includes identifying abnormal variation in the inspection results by comparing the inspection results generated at different times to each other. In addition, the method includes determining if the abnormal variation is attributable to the wafers, the wafer inspection recipe, or one or more of the at least one wafer inspection tool thereby determining if the wafer inspection recipe is stable over time.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: December 24, 2019
    Assignee: KLA—Tencor Corp.
    Inventors: Hucheng Lee, Lisheng Gao, Govindarajan Thattaisundaram
  • Patent number: 10490113
    Abstract: The present application discloses a voltage shift circuit and a driving method thereof, a driving device and a display apparatus. The voltage shift circuit includes: a first input terminal, a second input terminal, a first voltage terminal, a second voltage terminal, and an output terminal. The first input terminal is configured to input a first signal. The second input terminal is configured to input a second signal. The first voltage terminal is configured to input a first voltage. The second voltage terminal is configured to input a second voltage. The output terminal is configured to output an output signal. The voltage shift circuit is configured to lower the first voltage to an output voltage within a first time using the first signal, and to raise the second voltage to the output voltage within a second time using the second signal. The first time partially overlaps with the second time.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: November 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xianyong Gao, Shuai Hou, Lijun Xiao, Bo Xu, Siqing Fu, Xu Lu, Qiang Yu, Lisheng Liang, Shuai Chen, Fei Shang
  • Patent number: 10482836
    Abstract: A gate driver, a configuration system, and configuration method thereof is provided. The gate driver is used for providing a gate drive signal for a TFT array substrate and comprises at least a drive capability detection module and a drive capability adjustment module. The configuration system is configured to configure the driving capabilities of a plurality of gate drivers and comprises a controller provided outside the plurality of gate drivers. The driving capability of the gate driver becomes adjustable and configurable. The well balance of the drive capabilities of the drive control signals received by the different TFT array regions driven by the plurality of gate drivers configured by the configuration system can avoid the occurrence of a splitting-screen phenomenon.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: November 19, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Xianyong Gao, Yihjen Hsu, Lijun Xiao, Shuai Hou, Bo Xu, Lisheng Liang, Siqing Fu, Fei Shang, Haijun Qiu
  • Publication number: 20190333206
    Abstract: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.
    Type: Application
    Filed: July 11, 2019
    Publication date: October 31, 2019
    Inventors: Hucheng Lee, Lisheng Gao, Jan Lauber, Yong Zhang
  • Publication number: 20190279357
    Abstract: Methods and systems for determining a layer on which a defect detected on a wafer is located are provided. One method includes detecting defects on a wafer by directing light to the wafer at first and second angles of incidence and determining locations of the defects on the wafer based on the output corresponding to the defects. For one of the defects detected in the output generated for one spot illuminated on the wafer with the light directed to the wafer at the first and second angles, the method includes comparing the locations of the one of the defects determined based on the output generated with the light directed to the one spot on the wafer at the first and second angles. The method further includes determining a layer of the wafer on which the one of the defects is located based on results of the comparing.
    Type: Application
    Filed: March 5, 2019
    Publication date: September 12, 2019
    Inventors: Jingshan Zhong, Bjorn Brauer, Lisheng Gao
  • Patent number: 10410338
    Abstract: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: September 10, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Hucheng Lee, Lisheng Gao, Jan Lauber, Yong Zhang
  • Patent number: 10393671
    Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: August 27, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Govindarajan Thattaisundaram, Hucheng Lee, Lisheng Gao
  • Patent number: 10395359
    Abstract: Methods and systems for detecting defects on a wafer using adaptive local thresholding and color filtering are provided. One method includes determining local statistics of pixels in output for a wafer generated using an inspection system, determining which of the pixels are outliers based on the local statistics, and comparing the outliers to the pixels surrounding the outliers to identify the outliers that do not belong to a cluster of outliers as defect candidates. The method also includes determining a value for a difference in color between the pixels of the defect candidates and the pixels surrounding the defect candidates. The method further includes identifying the defect candidates that have a value for the difference in color greater than or equal to a predetermined value as nuisance defects and the defect candidates that have a value for the difference in color less than the predetermined value as real defects.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: August 27, 2019
    Assignee: KLA-Tencor Corp.
    Inventors: Junqing Huang, Hucheng Lee, Kenong Wu, Lisheng Gao