Patents by Inventor Lita Yang

Lita Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250054911
    Abstract: A method for three-dimensional memory stacking may include providing a logic die including a circuit and a memory, providing a memory die including an additional memory having a same footprint as the circuit and memory in the logic die, and stacking the logic die and the memory die three-dimensionally with die-to-die data communication between the circuit and the additional memory by face-to-face hybrid bonds. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: December 20, 2023
    Publication date: February 13, 2025
    Inventors: Huichu Liu, Simon James Hollis, Fan Wu, Huseyin Ekin Sumbul, Lita Yang, Edith Dallard
  • Publication number: 20250054910
    Abstract: A method for three-dimensionally stacking systems on chip with face to face hybrid bonding may include providing a first die including a driver gate driving a first via ladder coupled to a first top metal layer. The method may additionally include providing a second die including a load gate coupled to a second via ladder coupled to a second top metal layer. The method may also include stacking the first die and the second die three-dimensionally using face-to-face hybrid bonds to couple the first top metal layer to the second top metal layer. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: December 20, 2023
    Publication date: February 13, 2025
    Inventors: Huseyin Ekin Sumbul, Edith Dallard, Fan Wu, Huichu Liu, Lita Yang, Matheus Trevisan Moreira, Anuradha Krishnan, Gireesh Vijayakumar, Valerio Catalano
  • Publication number: 20250056815
    Abstract: A method for non-uniform memory access on three-dimensionally-stacked hybrid memory may include providing a logic die including a circuit and a memory. The method may additionally include providing a plurality of memory dies including an additional memory. The method may also include stacking the logic die and the plurality of memory dies three-dimensionally using face-to-face hybrid bonds that provide non-uniform access to the additional memory by the circuit. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: December 20, 2023
    Publication date: February 13, 2025
    Inventors: Lita Yang, Huseyin Ekin Sumbul, Fan Wu, Edith Dallard, Huichu Liu, Daniel Henry Morris