Abstract: A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units.

Abstract: An image capturing device includes a base defining a receiving space and having two spaced-apart through holes, first and second lens units disposed within the receiving space, a circuit board connected to a bottom end of the base, and two sensor elements disposed on a top face of the circuit board below the first and second lens units. The first lens unit defines a first light communicating path corresponding in position with one of the through holes. The second lens unit defines a second light communicating path corresponding in position with the other through hole. The first and second lens units and the sensor elements are inclined inwardly, so that the first and second light communicating paths intersect each other in an extended direction and in the area external to the base.