Abstract: A sputtering apparatus includes a sputtering cathode and a target overlying the sputtering cathode. A shield overlies the target and forms an aperture configured to direct sputtering particles onto a substrate. The shield includes a lower shield portion overlying the target, a channel outlet overlying the lower shield portion, and an upper shield portion overlying the channel. In some embodiments the shield includes a first shield and a second shield. The first shield includes a front gas injection outlet. The second shield overlies the first shield and forms the aperture. In various embodiments, the second shield is operable to adjust plasma confinement between the first shield and the second shield.

Abstract: Software testing uses a plurality of test cases, where each of the test cases includes a plurality of test tasks. The test cases are analyzed to obtain at least one reusable test task sequence between at least two test cases. The reusable test task sequence includes at least one identical test task. The test cases are divided into at least one test case group according to the reusable test task sequence, where the test cases in each of the test case groups has at least one reusable test task sequence. For each of the test cases of the at least one test case group, an execution script of each test case is generated by using an execution script of a reusable test task, where the execution script of each test case includes at least one of backup or restore for the reusable test task sequence.

Abstract: Software testing uses a plurality of test cases, where each of the test cases includes a plurality of test tasks. The test cases are analyzed to obtain at least one reusable test task sequence between at least two test cases. The reusable test task sequence includes at least one identical test task. The test cases are divided into at least one test case group according to the reusable test task sequence, where the test cases in each of the test case groups has at least one reusable test task sequence. For each of the test cases of the at least one test case group, an execution script of each test case is generated by using an execution script of a reusable test task, where the execution script of each test case includes at least one of backup or restore for the reusable test task sequence.

Abstract: The present invention is directed to a camera lens filter assembly including a camera lens filter and an included optical component. The optical component is installed on an optic mounting part; and a clamp is mounted on a clamp mounting part, so the clamp can press to tighten against the optical component for the purpose of assembly. The present invention efficiently prevents air, dust and other environmental pollutants from reaching the front surface of the camera lens and will also seal to secure the camera lens filter to the camera lens barrel in a way that it will not dismount itself due to vibration, use or other operating conditions.

Abstract: A method of manufacturing a plurality of stacked die semiconductor packages, including: attaching a second silicon wafer to a first silicon wafer, wherein the second silicon wafer has a plurality of open vias; attaching a third silicon wafer to the second silicon wafer, wherein the third silicon wafer has a plurality of open vias, and the open vias of the second and third silicon wafers are aligned with one another; etching a bonding material that attaches the wafers from the aligned open vias; filling the aligned open vias with a conductor; forming conductive bumps at open ends of the aligned open vias; back grinding the first silicon wafer; separating the stacked semiconductor dies from each other; attaching the bump end of the stacked semiconductor dies onto a substrate; encapsulating the stacked semiconductor dies and substrate; and singulating the encapsulated assembly.

Abstract: A method of manufacturing a plurality of stacked die semiconductor packages, including: placing a phase change material between a top surface of a substrate and a bottom surface of a first die; placing a phase change material between a top surface of the first die and a bottom surface of a second die; wherein the first and second dies have a plurality of conductive protrusions on the bottom surfaces of the dies; wherein the first die has a plurality of conductive vias extending from its conductive protrusions, through the first die, to the top surface of the first die; wherein the conductive vias of said first die are in alignment with the conductive protrusions of the second die; and heating the dies and the substrate to cause the second die to become electrically interconnected to the first die and the first die to become electrically connected to the substrate.

Abstract: A method of manufacturing a plurality of stacked die semiconductor packages, including: attaching a second silicon wafer to a first silicon wafer, wherein the second silicon wafer has a plurality of open vias; attaching a third silicon wafer to the second silicon wafer, wherein the third silicon wafer has a plurality of open vias, and the open vias of the second and third silicon wafers are aligned with one another; etching a bonding material that attaches the wafers from the aligned open vias; filling the aligned open vias with a conductor; forming conductive bumps at open ends of the aligned open vias; back grinding the first silicon wafer; separating the stacked semiconductor dies from each other; attaching the bump end of the stacked semiconductor dies onto a substrate; encapsulating the stacked semiconductor dies and substrate; and singulating the encapsulated assembly.

Abstract: Systems and methods for automatic generation of a browsing path across image content to present areas with high attention value are described. In particular, an image is modeled via multiple visual attentions to create a respective set of attention objects for each modeled attention. The attention objects and their respective attributes are analyzed to generate a browsing path to select ones of the attention objects. The browsing path is generated to optimize the rate of information gain from the attention objects as a function of information unit cost in terms of time constraints associated with multiple image browsing modes.

Abstract: A method of manufacturing a plurality of stacked die semiconductor packages, including: placing a phase change material between a top surface of a substrate and a bottom surface of a first die; placing a phase change material between a top surface of the first die and a bottom surface of a second die; wherein the first and second dies have a plurality of conductive protrusions on the bottom surfaces of the dies; wherein the first die has a plurality of conductive vias extending from its conductive protrusions, through the first die, to the top surface of the first die; wherein the conductive vias of said first die are in alignment with the conductive protrusions of the second die; and heating the dies and the substrate to cause the second die to become electrically interconnected to the first die and the first die to become electrically connected to the substrate.

Abstract: A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.

Abstract: Systems and methods for automatic generation of a browsing path across image content to present areas with high attention value are described. In particular, an image is modeled via multiple visual attentions to create a respective set of attention objects for each modeled attention. The attention objects and their respective attributes are analyzed to generate a browsing path to select ones of the attention objects. The browsing path is generated to optimize the rate of information gain from the attention objects as a function of information unit cost in terms of time constraints associated with multiple image browsing modes.

Abstract: A method of packaging circuit devices in which a heat slug is inserted into an aperture in the substrate. A heat slug is therefore incorporated into the package without adding to the total size or weight of the package.

Abstract: A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.