Patents by Inventor Liu Hau

Liu Hau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11994923
    Abstract: A dongle coupled between a power supplying device for supplying power and a power receiving device for receiving power includes a downstream facing port (DFP), an upstream facing port (UFP) and a controller. The controller is arranged to control deliveries of the power and messages between the power supplying device and the power receiving device. In response to a first power request message received from the power receiving device, the controller is arranged to determine whether a power type request by the power receiving device is Programmable Power Supply (PPS) according to the first power request message. When determining that the power type request by the power receiving device is PPS, the controller is arranged to start first waiting timer, and when the first waiting timer expires, the controller is arranged to send a request accept message to the power receiving device through the UFP.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: May 28, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Liu Yi, Dandan Zhu, Yuan Deng, Congyu Zhang, Neng-Hsien Lin, Tsung-Tao Wu, Fan-Hau Hsu
  • Publication number: 20070075826
    Abstract: The present invention discloses methods for manufacturing chip resistor networks, which are free from the short circuit owing to electron migration of the silver electrodes. In one embodiment of the present invention, a barrier layer is formed to prevent the silver electrodes from electron migration. In another embodiment of the present invention, copper or nickel electrodes are formed to replace silver electrodes. These methods for manufacturing chip resistor networks are the ways to solve the short circuit caused by electron migration of the silver electrodes.
    Type: Application
    Filed: June 16, 2006
    Publication date: April 5, 2007
    Inventors: Chun-Tiao Liu, Minhor-Hsiao, Hung Lin, Peng Wen-Lung, Liu Hau