Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more actuator coil leads, such as by solder bump bonding, and the flexible cable/actuator coil coupling is embedded in an actuator frame, such as by polymer injection molding.

Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.

Abstract: A system and method are disclosed for improving the electrical connection of a hard drive relay flexible circuit assembly to a head-gimbal assembly (HGA) flexure cable. In one embodiment, a flexible circuit assembly is attached to a hard drive coil carriage via a U-shaped connector and is electrically coupled to the HGA flexure cable by a bonding agent, such as an Anisotropic Conductive Film (ACF).

Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.

Abstract: A system and method are disclosed for improving the electrical connection of a hard drive relay flexible circuit assembly to a head-gimbal assembly (HGA) flexure cable. In one embodiment, a flexible circuit assembly is attached to a hard drive coil carriage via a U-shaped connector and is electrically coupled to the HGA flexure cable by a bonding agent, such as an Anisotropic Conductive Film (ACF).

Abstract: An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.

Abstract: An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.

Abstract: An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.

Abstract: An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.

Abstract: A head actuator mechanism and a method of manufacture for that mechanism are disclosed. The head actuator mechanism includes a head gimbal assembly coupled to the top support face of a bearing assembly and an actuator driving mechanism coupled to the opposite support face. The head gimbal assembly includes an actuator arm and a load beam, the actuator arm being mounted to the top support face. The actuator driving assembly includes a driving coil and a coil holder frame. The driving coil is positioned in a magnetic field created by a magnetic block and yoke.

Abstract: A head actuator mechanism and a method of manufacture for that mechanism are disclosed. The head actuator mechanism includes a head gimbal assembly coupled to the top support face of a bearing assembly and an actuator driving mechanism coupled to the opposite support face. The head gimbal assembly includes an actuator arm and a load beam, the actuator arm being mounted to the top support face. The actuator driving assembly includes a driving coil and a coil holder frame. The driving coil is positioned in a magnetic field created by a magnetic block and yoke.

Abstract: A method and apparatus for electrically coupling a slider to a controller circuit are disclosed. In one embodiment, a pre-amplifier with an integrated electrical connector (I-connector) may be connected via an electrical trace to a slider and via a head stack assembly flexible circuit to a control circuit. The pre-amplifier may have two parallel series of spring probe claws, two parallel series of contact pegs, two slots, or a slot and a rotary cam.

Abstract: A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexible cable is coupled to one or more actuator coil leads, such as by solder bump bonding, and the flexible cable/actuator coil coupling is embedded in an actuator frame, such as by polymer injection molding.

Abstract: A system and method for an improved magnetic head arm assembly (HAA), reducing complexity of design and difficulty of manufacture, is disclosed.

Abstract: An actuator driving mechanism and a method of manufacture for that mechanism are disclosed. In one embodiment, the actuator driving mechanism includes a statically located stator generating a variable magnetic field to act upon a mobile rotator generating a permanent magnetic field. In a further embodiment, the stator includes a set of driving coils to generate the variable magnetic field and the rotator includes a permanent magnet coupled to a holding frame.