Patents by Inventor Liu Ming-Tsung

Liu Ming-Tsung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a bonding pad
    Patent number: 5834365
    Abstract: A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.
    Type: Grant
    Filed: August 25, 1997
    Date of Patent: November 10, 1998
    Assignee: United Microelectronics Corp.
    Inventors: Liu Ming-Tsung, Bill Y. B. Hsu, Hsien-Dar Chung, Dev-Yuan Wu
  • Bonding pad structure and method thereof
    Patent number: 5703408
    Abstract: A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.
    Type: Grant
    Filed: April 10, 1995
    Date of Patent: December 30, 1997
    Assignee: United Microelectronics Corporation
    Inventors: Liu Ming-Tsung, Bill Y. B. Hsu, Hsien-Dar Chung, Der-Yuan Wu