Patents by Inventor Liu Pilin

Liu Pilin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
    Publication number: 20110290864
    Abstract: Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.
    Type: Application
    Filed: August 8, 2011
    Publication date: December 1, 2011
    Inventors: Mengzhi PANG, Liu Pilin, Charan GURUMURTHY
  • SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
    Publication number: 20100155947
    Abstract: Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.
    Type: Application
    Filed: December 24, 2008
    Publication date: June 24, 2010
    Inventors: Mengzhi PANG, Liu Pilin, Charan GURUMURTHY