Abstract: Disclosed is a protecting device for electronic circuit and the manufacturing method thereof. The device is a multi-layered structure which includes a dielectric layer and several electrode layers overlapping in the inner circumference of the substrate. After making up a whole structure, a transverse gap with an appropriate depth is formed by cutting process causing two superposed electrode layers to split into two parts facing to each other with respect to the transverse gap and also split into upper and lower parts with respect to the dielectric layer. With this structure, the gap can serve as a protecting element for electrostatic discharge (ESD) or other elements by filling different materials and with the aid of the dielectric layer of appropriate thickness thereby the whole structure can be used to perform surge protection for various electronic circuits.