Abstract: An implanted ECOG electrode, a manufacturing method thereof, and a computer-readable storage medium are provided in the application. The implanted ECOG electrode includes an electrode contact region and a welding pad region. The electrode contact region includes electrode contacts. A hollowed-out portion is disposed a position, except for an end portion of the conductive wire, between adjacent two electrode contacts, and the hollowed-out portion penetrates through a top surface and a bottom surface of the electrode contact region.

Abstract: An example manufacturing method includes performing first ion implantation into a first area of a substrate to form a buried layer. Second ion implantation into a second area of the substrate is performed to form a pre-dopant, where the second area is disposed around a periphery of the first area, and a thermal diffusion capability of ions in the pre-dopant is higher than a thermal diffusion capability of ions at the buried layer. An epitaxial layer is formed on a side, of the substrate, on which the buried layer and the pre-dopant are disposed. Third ion implantation into the epitaxial layer is performed, in correspondence to the second area, to form a deep well. Thermal annealing is performed to thermally diffuse ions at the buried layer, in the pre-dopant, and in the deep well.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: A power semiconductor device includes a P-type substrate, an N-type well region, a P-type body region, a gate oxide layer, a polysilicon gate, a first oxide layer, a first N+ contact region, a first P+ contact region, drain metal, a first-type doped region, and a gate oxide layer. An end of the P-type body region is flush with or exceeds an end of the polysilicon gate, wherein Cgd of the power semiconductor device is reduced and a switching frequency of the power semiconductor device is increased. A polysilicon field plate connected with a source is introduced over a drift region that is not only shield an influence of the polysilicon gate on the drift region, thereby eliminating Cgd caused by overlapping of traditional polysilicon gate and drift region, but also enable the power semiconductor device to have strong robustness against an hot carrier effect.

Abstract: A power semiconductor device includes a P-type substrate, an N-type well region, a P-type body region, a gate oxide layer, a polysilicon gate, a first oxide layer, a first N+ contact region, a first P+ contact region, drain metal, a first-type doped region, and a gate oxide layer. An end of the P-type body region is flush with or exceeds an end of the polysilicon gate, wherein Cgd of the power semiconductor device is reduced and a switching frequency of the power semiconductor device is increased. A polysilicon field plate connected with a source is introduced over a drift region that is not only shield an influence of the polysilicon gate on the drift region, thereby eliminating Cgd caused by overlapping of traditional polysilicon gate and drift region, but also enable the power semiconductor device to have strong robustness against an hot carrier effect.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: The present invention discloses a down lamp, comprising a housing and a wiring terminal (1) disposed in the housing, and the housing comprises a front shell (2) and a rear cap (3), wherein the rear cap (3) has an opening (4) at the location corresponding to the wiring terminal (1) and the opening (4) is provided with a terminal cap (5) that is matched with the opening and is in detachable connection with the rear cap (3), which is convenient in wiring.

Abstract: The present invention relates to the technical field of lighting fittings, in particular to a panel lamp. The panel lamp comprises a frame (1), a lamp panel (2), a light guide plate (3), a reflective sheet (9), a lampshade (4) and a rib (6) supporting the lampshade (4) wherein there is a clearance between the light guide plate (3) and the lampshade (4), which is good in irradiation effect and comfortable for users to use.

Abstract: The present invention relates to the technical field of lighting fittings, in particular to a panel lamp. The panel lamp comprises a frame (1), a lamp panel (2), a light guide plate (3), a reflective sheet (9), a lampshade (4) and a rib (6) supporting the lampshade (4) wherein there is a clearance between the light guide plate (3) and the lampshade (4), which is good in irradiation effect and comfortable for users to use.

Abstract: The present invention discloses a down lamp, comprising a housing and a wiring terminal (1) disposed in the housing, and the housing comprises a front shell (2) and a rear cap (3), wherein the rear cap (3) has an opening (4) at the location corresponding to the wiring terminal (1) and the opening (4) is provided with a terminal cap (5) that is matched with the opening and is in detachable connection with the rear cap (3), which is convenient in wiring.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: Provided are systems and methods for indicating deployment of application features. In one embodiment, a method is provided that includes determining available features of a current deployment of an application for receiving machine-generated data from one or more data sources of a data system, determining un-deployed features of the current deployment of the application, wherein the un-deployed features comprise one or more of the available features that is configured to use input data from a data source and wherein the input data is not available to the feature in the current deployment of the application, and causing display of a deployment graphical user interface (GUI) that comprises an indication of the un-deployed features.

Abstract: A frequency modulation (FM) circuit, built in an electronic device, comprises an antenna circuit for signal receiving, an FM module connected with the antenna circuit for transforming FM signals of incoming signals into respective audio signals, and a controller connected with the FM module for forwarding the audio signals. The antenna circuit further includes an antenna, a low noise amplifier (LNA) and its matching circuit, a support structure, and a feed line. By providing the LNA and its matching circuit, the receiving sensitivity of the antenna circuit can be improved and the whole antenna circuit can be reduced to a size that is easily accommodated inside the electronic device. Also, an antenna circuit for the FM system circuit is provided as well.

Abstract: A method for forming the dual damascene structure over a semiconductor substrate is disclosed in the present invention. First, a first dielectric layer is formed on the semiconductor substrate. An etch stopping layer is formed on the first dielectric layer. And a second dielectric layer is formed on the etch stopping layer. The second dielectric layer is then etched till the etch stopping layer to form a first opening and a second opening on the second dielectric layer. It is noted that the size of the second opening is bigger than that of the first opening. A polymer layer is next formed on the second dielectric layer and the etch stopping layer to close the first opening and to fill into a portion of the second opening for defining a third opening in the second opening.

Abstract: An IC card kit adapted for receiving a circuit board assembly, which assembly includes a generally planar circuit substrate with an electrical circuit and electrical components mounted on a surface thereof. The electrical circuit includes a ground circuit. The kit includes a frame adapted for receiving the circuit board assembly, a receptacle connector for mounting at the edge of the assembly, a pair of cover panels for sandwiching the frame and circuit board assembly, and a conductive grounding clip on the frame for engaging the ground circuit of the circuit board assembly. The clip includes a spring arm for preassembling the circuit board assembly to the frame.