Abstract: An IC card kit adapted for receiving a circuit board assembly, which assembly includes a generally planar circuit substrate with an electrical circuit and electrical components mounted on a surface thereof. The electrical circuit includes a ground circuit. The kit includes a frame adapted for receiving the circuit board assembly, a receptacle connector for mounting at the edge of the assembly, a pair of cover panels for sandwiching the frame and circuit board assembly, and a conductive grounding clip on the frame for engaging the ground circuit of the circuit board assembly. The clip includes a spring arm for preassembling the circuit board assembly to the frame.

Abstract: An ejector mechanism is provided for ejecting an IC card from a header connector which has a mating end, a terminating end and first and second opposite sides extending between the ends. A generally L-shaped ejector frame is adapted to be mounted about the header connector with a base leg of the L-shaped frame along the terminating end of the header connector and a side leg along one side of the header connector. The side leg has a channel therein. An ejector lever is pivotally mounted on at least one of the header connector or the ejector frame and has a first lever end and a second lever end. The second lever end is adapted to eject the IC card from the header connector. An elongated push-rod is reciprocally mounted in the channel and has a first rod end pivotally associated with the first lever end of the ejector lever and a second rod end for manual actuation to effect pivoting of the eject lever and ejection of the IC card.