Abstract: An open microfocus X-ray source and a control method thereof are provided. The open microfocus X-ray source includes: an open X-ray tube, a high voltage power supply (HVPS) system, a vacuum system and a control system. The open X-ray tube includes a cathode system, a deflection system and a focusing system. The HVPS system is configured to provide an emission current I0, an accelerating high voltage U0 and a grid voltage UG for an electron beam. The vacuum system is configured to perform vacuumization. The control system is configured to control, according to a spot size of an electron beam for bombarding an anode target, the HVPS system to adjust the emission current I0, the accelerating high voltage U0, a deflection coil current IXY of the deflection system, and a focusing coil current IF of the focusing system, such that the spot size meets a preset requirement.

Abstract: A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

Abstract: An open microfocus X-ray source and a control method thereof are provided. The open microfocus X-ray source includes: an open X-ray tube, a high voltage power supply (HVPS) system, a vacuum system and a control system. The open X-ray tube includes a cathode system, a deflection system and a focusing system. The HVPS system is configured to provide an emission current I0, an accelerating high voltage U0 and a grid voltage UG for an electron beam. The vacuum system is configured to perform vacuumization. The control system is configured to control, according to a spot size of an electron beam for bombarding an anode target, the HVPS system to adjust the emission current I0, the accelerating high voltage U0, a deflection coil current IXY of the deflection system, and a focusing coil current IF of the focusing system, such that the spot size meets a preset requirement.

Abstract: A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

Abstract: The invention discloses a brazing method for a glass Kovar combination and an oxygen-free copper, wherein the glass Kovar combination, the silver-based solder and the oxygen-free copper are placed within a quartz room with the pressure of 3.0×10?5˜7.0×10?5 Pa. The quartz room is heated by the coils of the high-frequency induction power; and the quartz room stops being heated quickly until reaching the melting temperature of the silver-based solder and then being cooled. The invention further discloses a corresponding brazing device, which simplifies the processing technology in the electronic vacuum industry, reduces the rejection rate greatly, has significant industrial economic value and is the important method of the energy conservation and environment protection. It enables the brazing process time to be short; the energy consumption to be reduced; the whole brazing process to be visible; the temperature to be monitored; and the manufacturing cost to be greatly reduced.