Abstract: A gate valve device includes a cleaning component, a first lifting component, and a second lifting component. The cleaning component is arranged on the second lifting component. The first lifting component is configured to control whether an opening on a side of a vacuum chamber close to a swing gate valve is in a closed state. The second lifting component is configured to, in a case that the opening on the side of the vacuum chamber close to the swing gate valve is in the closed state, control the cleaning component to clean the swing gate valve.

Abstract: A gate valve device includes a cleaning component, a first lifting component, and a second lifting component. The cleaning component is arranged on the second lifting component. The first lifting component is configured to control whether an opening on a side of a vacuum chamber close to a swing gate valve is in a closed state. The second lifting component is configured to, in a case that the opening on the side of the vacuum chamber close to the swing gate valve is in the closed state, control the cleaning component to clean the swing gate valve.

Abstract: Embodiments relate to a device for correcting a robotic arm, including: a first robotic arm positioned in a vacuum transmission chamber; a first jig wafer comprising a first wafer body and a first jig positioned on a front surface of the first wafer body; a first distance measuring sensor positioned at a center position of a back surface of the first wafer body and configured to detect whether a center of the first jig wafer is aligned with a center of a wafer chuck; a second distance measuring sensor positioned on the front surface of the first wafer body and on an outside of the first jig and configured to detect a lifting height of the first robotic arm when the first robotic arm controls a pick-and-place operation the first jig wafer on an upper surface of the wafer chuck.

Abstract: A method for correcting a robot is provided. The method includes: providing a correction device, wherein the correction device comprises a jig wafer; grabbing and/or transferring the jig wafer by using the robot to obtain collected data; determining, based on the collected data, whether the robot needs to be corrected; and in response to that the robot needs to be corrected, obtaining a compensation value according to the collected data, and correcting the robot based on the compensation value.