Patents by Inventor Liule WANG

Liule WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240203802
    Abstract: A package housing is provided and includes: an outer frame, a cover, a heat dissipation bottom plate, and a fixing structure. The cover is connected to a side of the outer frame. The heat dissipation bottom plate is connected to the other side of the outer frame, wherein the heat dissipation bottom plate, the outer frame, and cover cooperatively define a receiving space, the outer frame has a connecting member disposed inside the receiving space, the connecting member is disposed between the heat dissipation bottom plate and the cover. The fixing structure is configured to connect the connecting member to the cover, wherein a part of the fixing structure located in the receiving space has an autographic projection on the connecting member, and the entire autographic projection locates on a surface of the connecting member near the cover.
    Type: Application
    Filed: June 14, 2023
    Publication date: June 20, 2024
    Inventors: Ning YANG, Liule WANG, Hao CHEN