Abstract: Protective coatings with one or more additives dispersed therethrough are disclosed. A protective coating may comprise a poly(p-xylylene), or parylene. An additive may be configured to cause the protective coating to contrast (e.g., visibly, etc.) with features or components that are exposed beyond a periphery of the protective coating. Additives that provide other characteristics are also disclosed. In addition, methods for applying protective coatings according to this disclosure are disclosed, as are inspection methods.

Abstract: Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 ?m and at most about 2 ?m. Electronic devices that include such a protective coating are also disclosed.

Abstract: In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed.

Abstract: Protective coatings with one or more additives dispersed therethrough are disclosed. A protective coating may comprise a poly(p-xylylene), or parylene. An additive may be configured to cause the protective coating to contrast (e.g., visibly, etc.) with features or components that are exposed beyond a periphery of the protective coating. Additives that provide other characteristics are also disclosed. In addition, methods for applying protective coatings according to this disclosure are disclosed, as are inspection methods.

Abstract: A protective coating for an electronic device, such as a coating that is substantially impermeable to moisture and oxygen, comprises an ultra-thin film comprising a plurality of sub-layers formed by atomic layer deposition (ALD) processes. Low temperature ALD processes may be used to form the sub-layers of the protective coating. The density of the protective film may be enhanced with energy, to which the protective coating or sub-layers thereof may be exposed during deposition or intermittently during the deposition process. ALD apparatuses that are equipped to perform the disclosed processes are also disclosed, as are electronic devices that include the disclosed protective coatings.

Abstract: Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 ?m and at most about 2 ?m. Electronic devices that include such a protective coating are also disclosed.

Abstract: In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed.

Abstract: In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed.