Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A pneumatic arrow gun has a gun body, an arrow, a positioning sleeve, and a connecting wire. The arrow is for inserting into an air tube of the gun body. The positioning sleeve is temporarily mounted around the air tube, and the arrow is disposed through the positioning sleeve. The connecting wire connects the gun body to the positioning sleeve. Because the positioning sleeve is temporarily mounted around the air tube, the arrow slides forward relative to the positioning sleeve after triggering. When triggering the arrow, the connecting wire naturally dangles. When the arrow detaches from the air tube, the positioning sleeve located at a nock of the arrow due to the sliding of the arrow. Therefore, a rebound of the arrowhead is prevented. The safety and the shooting stability are ensured. Further, the arrow is easily retrieved by the connecting wire.

Abstract: In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.

Abstract: Provided are semiconductor devices that include a first gate structure having a first end cap portion, a second gate structure having a second end cap portion coaxial with the first gate structure, a first dielectric region separating the first end cap portion and the second end cap portion, a first conductive element extending over the first gate structure, a second conductive element extending over the second gate structure, and a gate via electrically connecting the second gate structure and the second conductive element, with the first dielectric region having a first width and being positioned at least partially under the first conductive element and defines a spacing between the gate via and an end of the second end cap portion that exceeds a predetermined distance.

Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.

Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: Methods and systems are presented for providing a framework to securely integrate third-party logic into electronic transaction processing workflow. Third-party programming code that implements different third-party logic may be obtained and stored in a repository. A transaction processing request is received from a third-party server, and an instance of a transaction processing module is instantiated within an operating runtime environment to process a transaction according to a workflow. When the instance of the transaction processing module has reached an interruption point, the instance of the transaction processing module is suspended, and a third-party programming code is executed within an isolated runtime environment. The third-party programming code is configured to provide an output value based on attributes of the transaction. The instance of the transaction processing module then determines whether to authorize or deny the transaction based in part on the output value.

Abstract: Methods and systems are presented for providing a framework to securely integrate third-party logic into electronic transaction processing workflow. Third-party programming code that implements different third-party logic may be obtained and stored in a repository. A transaction processing request is received from a third-party server, and an instance of a transaction processing module is instantiated within an operating runtime environment to process a transaction according to a workflow. When the instance of the transaction processing module has reached an interruption point, the instance of the transaction processing module is suspended, and a third-party programming code is executed within an isolated runtime environment. The third-party programming code is configured to provide an output value based on attributes of the transaction. The instance of the transaction processing module then determines whether to authorize or deny the transaction based in part on the output value.

Abstract: A device for recording videos includes an image signal processor to process frames captured in response to a request for recording a video at a first frame rate, and a video encoder to encode captured frames. The device also includes processing circuitry operative to allocate image buffers from memory in response to the request, and execute a camera software to direct the image signal processor to fill each image buffer with a batch of the captured frames. For each filled image buffer, a reference of the image buffer is passed from the camera software to a video software at a second rate, which is a fraction of the first frame rate. The processing circuitry then executes the video software to provide one frame at a time to the video encoder for encoding at the first frame rate.

Abstract: A device for recording videos includes an image signal processor to process frames captured in response to a request for recording a video at a first frame rate, and a video encoder to encode captured frames. The device also includes processing circuitry operative to allocate image buffers from memory in response to the request, and execute a camera software to direct the image signal processor to fill each image buffer with a batch of the captured frames. For each filled image buffer, a reference of the image buffer is passed from the camera software to a video software at a second rate, which is a fraction of the first frame rate. The processing circuitry then executes the video software to provide one frame at a time to the video encoder for encoding at the first frame rate.

Abstract: A bouncing support structure for baby walker includes a tubular stand, an upper housing and a lower housing respectively sleeved on an upper end and a lower end of the tubular stand, wherein the upper housing and the lower housing are selectively and reciprocally moved relative to the tubular stand, and respectively connected to an upper frame and a lower frame of the baby walker. An expandable tube sleeved on the tubular stand. The expandable tube has two opposite ends respectively connected to the upper housing and the lower housing. A resilient device is received in the tubular stand, wherein the resilient device has a first end secured on the tubular stand and a second end secured on the upper housing. The bouncing support structure provides a bouncing function to the baby walker when the upper housing is reciprocally moved relative to the tubular stand.

Abstract: Methods and apparatus of video decoding for a 360-degree video sequence are disclosed. According to one method, a bitstream comprising compressed data for a previous 360-degree frame and a current 360-degree frame in a 360-degree video sequence is received. A first view region in the previous 360-degree frame associated with a first field of view is determined for a user at a previous frame time. An extended region from the first view region in the current 360-degree frame is determined based on user's viewpoint information. The extended region in the current 360-degree frame is then decoded. A second view region in the current 360-degree frame associated with an actual field of view is rendered for the user at a current frame time.

Abstract: A baby walker includes a lower frame and an upper frame mounted onto the lower frame via a folding device, wherein the upper frame is provided to load the body weight of the user. The lower frame has multiple roller assemblies universally mounted on a bottom thereof and two parallel foldable rocking devices mounted on the bottom of the lower frame. Each rocking device includes a first seat and a second seat respectively securely mounted on the bottom of the lower frame. A rocking plate has two opposite ends respectively pivotally mounted into a corresponding one of the first seat and the second seat. The rocking plate has a straight side and a corresponding curved side. The first seat holds the rocking plate in place when the rocking is vertical and horizontal relative to the supporting face of the baby walker.

Abstract: A redundant power system aims to provide multiple main output power and multiple standby power to drive a plurality of loads operating in an operating mode or a standby mode. The redundant power system includes a plurality of power supplies and a back panel. Each power supply provides a main output power and a standby power. The back panel has a power bus path to converge the main output power. The power bus path is divided into multiple main power output paths each being controlled by a remote ON/OFF switch to determine whether to perform output, and multiple standby power output paths each has a conversion unit located thereon. The conversion unit converts the power in the power bus path and provides a simulated standby power to the loads in a normal.

Abstract: A redundant power system aims to provide multiple main output power and multiple standby power to drive a plurality of loads operating in an operating mode or a standby mode. The redundant power system includes a plurality of power supplies and a back panel. Each power supply provides a main output power and a standby power. The back panel has a power bus path to converge the main output power. The power bus path is divided into multiple main power output paths each being controlled by a remote ON/OFF switch to determine whether to perform output, and multiple standby power output paths each has a conversion unit located thereon. The conversion unit converts the power in the power bus path and provides a simulated standby power to the loads in a normal.