Patents by Inventor Liwen CAI

Liwen CAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10244620
    Abstract: A circuit board and a display device are disclosed. The circuit board is configured to be bonded onto a display substrate; the circuit board includes a bonding connection end, which includes a base film and a plurality of first connecting terminals disposed on the base film; regions, which are corresponding to at least part of the first connecting terminals, of the base film comprises a transparent membrane material. The circuit board improves the product quality monitoring level during the bonding process, and decreases the product risks.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: March 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Liwen Cai, Xianzhen Tang, Dingwei Zhang, Liang Chen, Ben Guo, Lei Xu, Fei Fang
  • Patent number: 10117339
    Abstract: Embodiments of the present invention provide a manufacturing jig and a manufacturing apparatus for a temperature measuring sample. The manufacturing jig for a temperature measuring sample includes a first clamping mechanism configured to clamp the strip thermometer and adjust position of the strip thermometer, so that the best temperature measuring point at an end of the strip thermometer is at width center point of the coupling end of the printed circuit board. With the first clamping mechanism, the best temperature measuring point can be located at the width center point of the coupling end, so that alignment deviation of the best temperature measuring point in the width direction of the coupling end due to manual alignment is greatly reduced, which further ensures temperature measuring result of the temperature measuring sample are more accurate, and accurate control on actual pressing temperature of the pressing device can be achieved.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: October 30, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Yan Jiang, Liwen Cai, Xiaowei Gong, Dan Li, Peng Sui
  • Publication number: 20170118840
    Abstract: A circuit board and a display device are disclosed. The circuit board is configured to be bonded onto a display substrate; the circuit board includes a bonding connection end, which includes a base film and a plurality of first connecting terminals disposed on the base film; regions, which are corresponding to at least part of the first connecting terminals, of the base film comprises a transparent membrane material. The circuit board improves the product quality monitoring level during the bonding process, and decreases the product risks.
    Type: Application
    Filed: September 22, 2016
    Publication date: April 27, 2017
    Inventors: Liwen CAI, Xianzhen TANG, Dingwei ZHANG, Liang CHEN, Ben GUO, Lei XU, Fei FANG
  • Publication number: 20150351255
    Abstract: Embodiments of the present invention provide a manufacturing jig and a manufacturing apparatus for a temperature measuring sample. The manufacturing jig for a temperature measuring sample includes a first clamping mechanism configured to clamp the strip thermometer and adjust position of the strip thermometer, so that the best temperature measuring point at an end of the strip thermometer is at width center point of the coupling end of the printed circuit board. With the first clamping mechanism, the best temperature measuring point can be located at the width center point of the coupling end, so that alignment deviation of the best temperature measuring point in the width direction of the coupling end due to manual alignment is greatly reduced, which further ensures temperature measuring result of the temperature measuring sample are more accurate, and accurate control on actual pressing temperature of the pressing device can be achieved.
    Type: Application
    Filed: November 20, 2014
    Publication date: December 3, 2015
    Inventors: Yan JIANG, Liwen CAI, Xiaowei GONG, Dan LI, Peng SUI