Patents by Inventor Liwen FAN

Liwen FAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9841438
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: December 12, 2017
    Assignee: Japan Electronic Materials Corporation
    Inventors: Teppei Kimura, Liwen Fan
  • Publication number: 20170082657
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Application
    Filed: November 22, 2016
    Publication date: March 23, 2017
    Inventors: Teppei KIMURA, Liwen FAN
  • Patent number: 9535096
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: January 3, 2017
    Assignee: Japan Electronic Materials Corporation
    Inventors: Teppei Kimura, Liwen Fan
  • Publication number: 20150301083
    Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.
    Type: Application
    Filed: July 25, 2013
    Publication date: October 22, 2015
    Inventors: Teppei KIMURA, Liwen FAN