Patents by Inventor Liwen Jin
Liwen Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220337577Abstract: A method and device for application login are provided. The method includes: in response to a target user account's operation of triggering and displaying a target application login interface, acquiring a target login feature of the target user account, the target login feature including at least one of geographical location information of the target user account or parameters of a device used for login (S401); and determining, according to the target login feature, information of third-party channel logins allowed for logging in the target application (S402); and displaying, according to the information of third-party channel logins, corresponding third-party login icons on the target application login interface to allow the target user account to select a corresponding target third-party login channel to log in the target application (S403).Type: ApplicationFiled: July 6, 2022Publication date: October 20, 2022Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.Inventors: Bing TAN, Yifeng DI, Jianmin LUO, Liwen JIN
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Publication number: 20180283845Abstract: An interferometer for characterizing a sample, the interferometer including a light emitter to produce a light beam. A wavelength modulator can dither a wavelength of the light beam to produce an input beam having an oscillating wavelength. A beam splitter can be configured to divide the input beam into a reference beam and a measurement beam. The reference beam can reflect from a mirror having a fixed position and return to the beam splitter. The measurement beam can reflect from the sample and return to the beam splitter. The beam splitter can interfere the received reference beam and measurement beam to form an output beam. A detector can convert the output beam to an electrical signal. A processor can control the wavelength modulator, receive the electrical signal, and determine a distance to the sample based on the electrical signal and the oscillating wavelength of the input beam.Type: ApplicationFiled: March 31, 2017Publication date: October 4, 2018Inventors: Mario Pacheco, Manish Dubey, Purushotham Kaushik Muthur Srinath, Deepak Goyal, Liwen Jin
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Patent number: 9554468Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.Type: GrantFiled: March 27, 2014Date of Patent: January 24, 2017Assignee: Intel CorporationInventors: Ching-Ping Janet Shen, Charan K. Gurumurthy, Dilan Seneviratne, Ravi Shankar, Liwen Jin, Deepak Arora
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Patent number: 9451696Abstract: Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.Type: GrantFiled: September 29, 2012Date of Patent: September 20, 2016Assignee: INTEL CORPORATIONInventors: Dilan Seneviratne, Ching-Ping J. Shen, Liwen Jin, Deepak Arora, Vinodhkumar Raghunathan
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Publication number: 20160141265Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.Type: ApplicationFiled: January 27, 2016Publication date: May 19, 2016Inventors: Liwen Jin, Dilan Seneviratne
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Patent number: 9320149Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.Type: GrantFiled: December 21, 2012Date of Patent: April 19, 2016Assignee: Intel CorporationInventors: Liwen Jin, Dilan Seneviratne
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Publication number: 20150181713Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.Type: ApplicationFiled: March 27, 2014Publication date: June 25, 2015Inventors: Ching-Ping Janet Shen, Charan K. Gurumurthy, Dilan Seneviratne, Ravi Shankar, Liwen Jin, Deepak Arora
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Publication number: 20140326441Abstract: The present invention involves both the geometrical specification of a structure and positioning the structure in the cluster layout to achieve rapid heating/cooling as a medium transverses through them, and with little pressure drop penalty.Type: ApplicationFiled: May 5, 2014Publication date: November 6, 2014Applicant: GCorelab Private, Ltd.Inventors: Poh Seng LEE, Liwen JIN, Xin Xian KONG, Wai Shing KUNG, Alan Boon Hong NG, Yi Jing KOAY
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Publication number: 20140177193Abstract: An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Inventors: Liwen Jin, Dilan Seneviratne
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Publication number: 20140090879Abstract: Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.Type: ApplicationFiled: September 29, 2012Publication date: April 3, 2014Inventors: Dilan SENEVIRATNE, Ching-Ping J. SHEN, Liwen JIN, Deepak ARORA, Vinodhkumar RAGHUNATHAN
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Publication number: 20130299145Abstract: A heat sink device for use with a component for the heat transfer, the component being either a heat source or a heat sink. The device includes the features of: A base having a curvilinear surface, which may include but not limited to a cylinder a hyperboloid, an elliptical paraboloid, a hemisphere, a sphere or a torus. The device includes an inlet for the flow of fluid through the device and an outlet to vent or drain the fluid. The device also includes a heat transfer zone located on the surface and intermediate the inlet and outlet, with the zone including a plurality of transverse channels and a plurality of oblique channels extending between adjacent transverse channels, such that the oblique and transverse channels define a fluid path for the fluid from the inlet to the outlet.Type: ApplicationFiled: April 18, 2013Publication date: November 14, 2013Inventors: Poh Seng LEE, Liwen JIN, Yan FAN
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Publication number: 20110287074Abstract: Disclosed herein are a variety of applications for an antimicrobial agent. The antimicrobial agent comprises a silanol containing molecule, the silanol containing molecule comprising silanols (R1R2R3SiOH), siloxanediols HO(R1R2SiO)nH, siloxanols HO(R1R2SiO)nSiR1R2R3 or combinations thereof, where R1, R2 and R3 are selected from alkyl or fluoroalkyl moieties having 1 to 4 carbon atoms, vinyl or aryl groups and n is less than about 6.Type: ApplicationFiled: May 24, 2011Publication date: November 24, 2011Applicant: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.Inventors: Liwen Jin, Ronald Howard Baney