Abstract: An array substrate has a display area and a bezel area located on at least one side of the display area. The bezel area includes a bonding region. The array substrate includes a substrate, a plurality of signal lines, a plurality of conductive bumps, and an insulating layer. The signal lines are disposed on the substrate. The conductive blocks are disposed on a portion of the substrate located in the bonding region, and a conductive bump is connected to at least one signal line. The insulating layer covers the plurality of signal lines and is located between every two adjacent conductive bumps. The conductive bump includes a conductive metal layer. A distance from a surface of the conductive metal layer away from the substrate to the substrate is less than or equal to a distance from a surface of the insulating layer away from the substrate to the substrate.

Abstract: An array substrate assembly, a method of manufacturing the array substrate assembly, a display panel and a display apparatus are disclosed. The array substrate assembly includes a drive control circuit located on the substrate and configured for driving. The drive control circuit includes a plurality of thin film transistors each including an active layer. The array substrate further includes a grounded electrostatic shield layer. The electrostatic shield layer is located between the substrate and the drive control circuit, and an orthogonal projection of the electrostatic shield layer on the substrate covers orthogonal projections of at least the active layers of the plurality of thin film transistors of the drive control circuit on the substrate.

Abstract: An array substrate assembly, a method of manufacturing the array substrate assembly, a display panel and a display apparatus are disclosed. The array substrate assembly includes a drive control circuit located on the substrate and configured for driving. The drive control circuit includes a plurality of thin film transistors each including an active layer. The array substrate further includes a grounded electrostatic shield layer. The electrostatic shield layer is located between the substrate and the drive control circuit, and an orthogonal projection of the electrostatic shield layer on the substrate covers orthogonal projections of at least the active layers of the plurality of thin film transistors of the drive control circuit on the substrate.