Patents by Inventor Lixia Zhou
Lixia Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11962449Abstract: This application relates to the mobile communications field, and in particular, to a technology for obtaining a reference signal in a wireless communications system. In one example method for obtaining a reference signal, a terminal device obtains position offset information. The terminal device obtains a first sequence based on the position offset information. The terminal device demodulates, by using the first sequence, a control channel signal carried in a control channel resource set to obtain downlink control information.Type: GrantFiled: March 3, 2022Date of Patent: April 16, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Lixia Xue, Xu Zhang, Yongxing Zhou
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Patent number: 11962387Abstract: This application provides a wireless communication method and an apparatus. In the method, a terminal device receives first indication information from a network device. The first indication information indicates a first maximum multiple-input multiple-output (MIMO) layer quantity N to be used by the terminal device when the terminal device performs wireless communication, where N is an integer greater than or equal to 1. The method further includes that the terminal device performs wireless communication with the network device based on the first maximum MIMO layer quantity N, so that the maximum MIMO layer quantity that the terminal device should use can be adjusted as required.Type: GrantFiled: February 2, 2022Date of Patent: April 16, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Xiaolei Tie, Han Zhou, Lixia Xue, Meng Hua
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Patent number: 11963221Abstract: A communication method for using an unlicensed frequency band is provided. The method includes: A first wireless device receives first indication information in a first time unit, where the first indication information is used to indicate a second wireless device to transmit data in a second time unit, or the first indication information is used to indicate a second wireless device not to transmit data in a second time unit, where the second time unit is a preset time unit used by the second wireless device to transmit data.Type: GrantFiled: March 10, 2021Date of Patent: April 16, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Xu Zhang, Lixia Xue, Yongxing Zhou
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Publication number: 20240103881Abstract: Disclosed methods respond to detecting the receipt, by a management controller, such as a baseboard management controller (BMC), of an information handling system, of a provisioning request from a management client, by rebooting the information handling system to initiate a Universal Extensible Firmware Interface (UEFI) boot sequence that is configured to load an EFI application, referred to herein a provisioning application. A two way communication channel such as a WebSocket is established between the management client and the management controller to stream OS image data corresponding to an OS image to the management controller. The OS image data streamed to the management controller is written to an OS image partition of a boot device, after which the stored OS image may be booted to load the OS. The provisioning request may be communicated as a representational state transfer (REST) compliant (RESTful) request using, in at least some deployments, a Redfish application programming interface (API).Type: ApplicationFiled: October 11, 2022Publication date: March 28, 2024Applicant: Dell Products L.P.Inventors: Tianhe LI, Zhuo ZHANG, Lixia HU, Kai ZHOU
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Patent number: 10131534Abstract: This disclosure provides systems, methods and apparatus for a via structure. In one aspect, an apparatus includes a substrate and a first electromechanical systems device on a surface of the substrate. The first electromechanical systems device includes a first metal layer and a second metal layer. A first via structure can be included on the surface of the substrate. The first via structure includes the first metal layer, the second metal layer, and a third metal layer. The first metal layer of the first electromechanical systems device may be the same metal layer as the first metal layer of the first via structure.Type: GrantFiled: October 20, 2011Date of Patent: November 20, 2018Assignee: SnapTrack, Inc.Inventors: Yaoling Pan, Lixia Zhou
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Patent number: 9294049Abstract: Fast-settling capacitive-coupled amplifiers are disclosed. The amplifiers use two Capacitive Coupled paths embedded in a Multipath Hybrid Nested Miller Compensation topology. One path is a direct high frequency path and the other path is a slower stabilization path. This combination results in a flat frequency response to and through the chopper frequency, and a fast settling response. Various exemplary embodiments are disclosed, including operational amplifier and instrumentation amplifier configurations.Type: GrantFiled: February 14, 2014Date of Patent: March 22, 2016Assignee: Maxim Integrated Products, Inc.Inventors: Johan Hendrik Huijsing, Qinwen Fan, Kofi Afolabi Anthony Makinwa, Daihong Fu, Jun Wu, Lixia Zhou
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Publication number: 20150346478Abstract: A display assembly includes an array of display elements disposed between a first substrate and a second substrate, the array of display elements including one or more thin film transistors (TFTs). A black mask arrangement is disposed between the first substrate and the second substrate, the black mask arrangement being configured to prevent light entering the display assembly from reaching the TFTs.Type: ApplicationFiled: September 29, 2014Publication date: December 3, 2015Inventors: Cheonhong Kim, Tsongming Kao, Jian Ma, Lixia Zhou, Tallis Young Chang, Shu-Jhih Chen, John Hyunchul Hong
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Publication number: 20140232456Abstract: Fast-settling capacitive-coupled amplifiers are disclosed. The amplifiers use two Capacitive Coupled paths embedded in a Multipath Hybrid Nested Miller Compensation topology. One path is a direct high frequency path and the other path is a slower stabilization path. This combination results in a flat frequency response to and through the chopper frequency, and a fast settling response. Various exemplary embodiments are disclosed, including operational amplifier and instrumentation amplifier configurations.Type: ApplicationFiled: February 14, 2014Publication date: August 21, 2014Applicant: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Johan Hendrik Huijsing, Qinwen Fan, Kofi Afolabi Anthony Makinwa, Daihong Fu, Jun Wu, Lixia Zhou
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Publication number: 20140192060Abstract: Systems, methods and apparatus are provided for controlling launch effects of movable layers in electromechanical systems (EMS) devices. First and second EMS devices with first and second step creating layers are positioned over a substrate and spaced, by different gaps, from the movable layers of the EMS devices. The movable layers of the first and second EMS devices include steps having different heights and/or different edge spacing from the center of an anchoring region of each EMS device. The different steps can provide different launch effects for different EMS devices, and if the same thickness of sacrificial material is used for the different devices, the different launch effects can be responsible for different gap heights in the unbiased conditions.Type: ApplicationFiled: January 8, 2013Publication date: July 10, 2014Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Yi Tao, Fan Zhong, Lixia Zhou
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Publication number: 20130251201Abstract: A system for recommending buddies in a social network includes a data management module, a face detection and characteristics extraction module, a face matching module, a user avatar determining module, a buddy recommendation computing module and a buddy recommendation control module. The buddy recommendation control module extracts photo album data of respective users from a data management module, controls the face detection and characteristics extraction module to perform face detection and extraction of face characteristics data, and constructs a photo album face characteristics table comprising extracted face characteristics data for respective users.Type: ApplicationFiled: March 21, 2013Publication date: September 26, 2013Applicant: Samsung Electronics Co., Ltd.Inventor: Lixia ZHOU
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Publication number: 20130100143Abstract: This disclosure provides systems, methods and apparatus for a via structure. In one aspect, an apparatus includes a substrate and a first electromechanical systems device on a surface of the substrate. The first electromechanical systems device includes a first metal layer and a second metal layer. A first via structure can be included on the surface of the substrate. The first via structure includes the first metal layer, the second metal layer, and a third metal layer. The first metal layer of the first electromechanical systems device may be the same metal layer as the first metal layer of the first via structure.Type: ApplicationFiled: October 20, 2011Publication date: April 25, 2013Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.Inventors: Yaoling PAN, Lixia ZHOU
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Patent number: 8022896Abstract: A MEMS (Microelectromechanical system) device is described. The device includes an array of MEMS elements with addressing lines and MEMS switches configured to selectively connect the addressing lines to a ground or other potential in the event of an over-voltage, such as during an ESD event. The arrangement is particularly advantageous for protecting the array, because the MEMS switches can be formed using substantially the same processing steps which are used to form the array.Type: GrantFiled: August 8, 2007Date of Patent: September 20, 2011Assignee: Qualcomm Mems Technologies, Inc.Inventors: Je-Hsiung Lan, Lixia Zhou
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Publication number: 20090040136Abstract: A MEMS (Microelectromechanical system) device is described. The device includes an array of MEMS elements with addressing lines and MEMS switches configured to selectively connect the addressing lines to a ground or other potential in the event of an over-voltage, such as during an ESD event. The arrangement is particularly advantageous for protecting the array, because the MEMS switches can be formed using substantially the same processing steps which are used to form the array.Type: ApplicationFiled: August 8, 2007Publication date: February 12, 2009Applicant: QUALCOMM IncorporatedInventors: Je-Hsiung Lan, Lixia Zhou