Abstract: A novel direct-ink-writing (DIW) method for printing a strain gauge array circuit is disclosed. Firstly, the whole circuit is layered by a 3D printing method; a thin layer of insulating material is printed on the first circuit layer, instead of printing an insulating bridge, to form the second insulating layer; a part needing to contact the second insulating layer is not printed, but one through hole is reserved; the second circuit layer is then printed; the functional layer of the strain gauge is finally covered; the electrodes on the functional layer can contact the second circuit layer or can contact the first circuit layer through the through holes, which ensures that the functional layer contacts the two circuit layers, and also ensures the insulation in a cross part of a matrix circuit; the printing of the array strain gauge is effectively completed; and the stability of measurement is ensured.

Abstract: In a direct-ink-writing (DIW) method for printing a strain gauge array circuit, several insulating strips are printed on the upper layer of the first circuit layer after the first circuit layer has been printed and cured, and the second circuit layer is then printed at the insulating strips. The functional layer of a strain gauge is printed and covered thereon without contacting the insulating strips; the head and tail electrodes of the functional layer are respectively connected to two layers of circuit layers; and finally, a layer of insulating material is printed for encapsulation. DIW is used to complete the whole printing. A new insulating method is used in a cross part of two silver lines of a row-column compound circuit. The local glue dispensing is changed to printing the insulating strips in routing regions, and ensures the strain transmission efficiency from the strain gauge substrate to the functional layer.

Abstract: A novel direct-ink-writing (DIW) method for printing a strain gauge array circuit is disclosed. Firstly, the whole circuit is layered by a 3D printing method; a thin layer of insulating material is printed on the first circuit layer, instead of printing an insulating bridge, to form the second insulating layer; a part needing to contact the second insulating layer is not printed, but one through hole is reserved; the second circuit layer is then printed; the functional layer of the strain gauge is finally covered; the electrodes on the functional layer can contact the second circuit layer or can contact the first circuit layer through the through holes, which ensures that the functional layer contacts the two circuit layers, and also ensures the insulation in a cross part of a matrix circuit; the printing of the array strain gauge is effectively completed; and the stability of measurement is ensured.

Abstract: In a direct-ink-writing (DIW) method for printing a strain gauge array circuit, several insulating strips are printed on the upper layer of the first circuit layer after the first circuit layer has been printed and cured, and the second circuit layer is then printed at the insulating strips. The functional layer of a strain gauge is printed and covered thereon without contacting the insulating strips; the head and tail electrodes of the functional layer are respectively connected to two layers of circuit layers; and finally, a layer of insulating material is printed for encapsulation. DIW is used to complete the whole printing. A new insulating method is used in a cross part of two silver lines of a row-column compound circuit. The local glue dispensing is changed to printing the insulating strips in routing regions, and ensures the strain transmission efficiency from the strain gauge substrate to the functional layer.