Patents by Inventor Lixiong Luo

Lixiong Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor including cup-shaped leadframe packaging techniques
    Patent number: 9040356
    Abstract: A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: May 26, 2015
    Assignee: Vishay-Siliconix
    Inventors: Mike Chang, King Owyang, Yueh-Se Ho, Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
  • SEMICONDUCTOR PACKAGING TECHNIQUES
    Publication number: 20090256246
    Abstract: A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
    Type: Application
    Filed: June 19, 2009
    Publication date: October 15, 2009
    Applicant: VISHAY-SILICONIX
    Inventors: Mike Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
  • Semiconductor die package including cup-shaped leadframe
    Patent number: 7595547
    Abstract: A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: September 29, 2009
    Assignee: Vishay-Siliconix
    Inventors: Mike Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
  • Semiconductor assembly with package using cup-shaped lead-frame
    Patent number: 6909170
    Abstract: A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: June 21, 2005
    Assignee: Siliconix Incorporated
    Inventors: Mike Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
  • Semiconductor die package including cup-shaped leadframe
    Patent number: 6744124
    Abstract: A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: June 1, 2004
    Assignee: Siliconix Incorporated
    Inventors: Mike Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
  • Semiconductor assembly with package using cup-shaped lead frame
    Publication number: 20030057532
    Abstract: A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.
    Type: Application
    Filed: November 7, 2002
    Publication date: March 27, 2003
    Inventors: Mike Chang, King Owyang, Yueh-Se Ho, Y. Mohammed Kasem, Lixiong Luo, Wei-Bing Chu
  • IC chip package with directly connected leads
    Patent number: 6249041
    Abstract: An improved semiconductor device is disclosed. In one embodiment, the semiconductor device includes a semiconductor chip with contact areas on the top or bottom surface. A first lead assembly, formed from a semi-rigid sheet of conductive material, has a lead assembly contact attached to one of the contact areas of the semiconductor chip. The first lead assembly also has at least one lead connected to and extending from the lead assembly contact. A second lead assembly, also formed from a semi-rigid sheet of conductive material, has a lead assembly contact attached to another one of the contact areas of the semiconductor chip. The second lead assembly also has at least one lead connected to and extending from the lead assembly contact. An encapsulant encloses the semiconductor chip, the lead assembly contact of the first lead assembly and the lead assembly contact of the second lead assembly.
    Type: Grant
    Filed: June 2, 1998
    Date of Patent: June 19, 2001
    Assignee: Siliconix Incorporated
    Inventors: Y. Mohammed Kasem, Anthony C. Tsui, Lixiong Luo, Yueh-Se Ho