Patents by Inventor Liya Flores Aquino

Liya Flores Aquino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-cut plating lines on lead frames and laminate substrates for saw singulation
    Patent number: 10854474
    Abstract: Described herein is a technology or a method for pre-fabricating pre-cut plating lines on a lead frame with use of a pre-cut etchback process to minimize burrs during a semiconductor package singulation process. A package includes: a chip, and a lead frame that mounts the chip. The lead frame further includes pre-fabricated pre-cut plating lines that are etched back on the lead frame to form an opening slot on a periphery of the lead frame. The opening slot allows a saw blade to cut through a prepreg material, without touching or cutting a conductive material of the lead frame.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: December 1, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Erma Gallenero Gardose, Liya Flores Aquino
  • PRE-CUT PLATING LINES ON LEAD FRAMES AND LAMINATE SUBSTRATES FOR SAW SINGULATION
    Publication number: 20200234975
    Abstract: Described herein is a technology or a method for pre-fabricating pre-cut plating lines on a lead frame with use of a pre-cut etchback process to minimize burrs during a semiconductor package singulation process. A package includes: a chip, and a lead frame that mounts the chip. The lead frame further includes pre-fabricated pre-cut plating lines that are etched back on the lead frame to form an opening slot on a periphery of the lead frame. The opening slot allows a saw blade to cut through a prepreg material, without touching or cutting a conductive material of the lead frame.
    Type: Application
    Filed: April 7, 2020
    Publication date: July 23, 2020
    Inventors: Erma Gallenero Gardose, Liya Flores Aquino
  • Pre-cut plating lines on lead frames and laminate substrates for saw singulation
    Patent number: 10615053
    Abstract: Described herein is a technology or a method for pre-fabricating pre-cut plating lines on a lead frame with use of a pre-cut etchback process to minimize burrs during a semiconductor package singulation process. A package includes: a chip, and a lead frame that mounts the chip. The lead frame further includes pre-fabricated pre-cut plating lines that are etched back on the lead frame to form an opening slot on a periphery of the lead frame. The opening slot allows a saw blade to cut through a prepreg material, without touching or cutting a conductive material of the lead frame.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: April 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Erma Gallenero Gardose, Liya Flores Aquino
  • PRE-CUT PLATING LINES ON LEAD FRAMES AND LAMINATE SUBSTRATES FOR SAW SINGULATION
    Publication number: 20190378726
    Abstract: Described herein is a technology or a method for pre-fabricating pre-cut plating lines on a lead frame with use of a pre-cut etchback process to minimize burrs during a semiconductor package singulation process. A package includes: a chip, and a lead frame that mounts the chip. The lead frame further includes pre-fabricated pre-cut plating lines that are etched back on the lead frame to form an opening slot on a periphery of the lead frame. The opening slot allows a saw blade to cut through a prepreg material, without touching or cutting a conductive material of the lead frame.
    Type: Application
    Filed: June 7, 2018
    Publication date: December 12, 2019
    Inventors: Erma Gallenero Gardose, Liya Flores Aquino