Patents by Inventor Liya V. Danchukova

Liya V. Danchukova has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat conductive material
    Patent number: 6914025
    Abstract: This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of such materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles silicone carbide and silicon and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm2/s.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: July 5, 2005
    Assignee: Skeleton Technologies AG
    Inventors: Thommy Ekstrom, Jie Zheng, Kauthar Kloub, Sergey K. Gordeev, Liya V. Danchukova
  • Heat conductive material
    Publication number: 20040053039
    Abstract: This invention relates to diamond-containing composite materials that have high thermal conductivity and thermal diffusivity, and to the use of such materials in heat sinks, heat spreading and other heat conductive applications. The material comprises diamond particles silicone carbide and silicon and has a thermal conductivity of at least 400 W/mK and a thermal diffusivity of at least 2.1 cm2/s.
    Type: Application
    Filed: September 22, 2003
    Publication date: March 18, 2004
    Inventors: Thommy Ekstrom, Jie Zheng, Kauthar Kloub, Sergery K. Gordeev, Liya V. Danchukova