Abstract: A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.

Abstract: An embodiment of an electronic apparatus may comprise one or more substrates and a controller coupled to the one or more substrates, the controller including circuitry to identify failed memory regions in a memory by a rank, bank, and device associated with the failed memory region, and provide recovery for failed memory regions in three or more banks of a first rank of the memory or three or more devices of the first rank of the memory by virtual lock step device data correction with one or more other ranks of the memory. Other embodiments are disclosed and claimed.