Patents by Inventor Liyang Ye

Liyang Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260196388
    Abstract: A method for preparing a superconducting integrated cable is provided, including: helically twisting a plurality of superconducting strands around a core wire to obtain a twisted cable; performing a heat treatment on the twisted cable to obtain an initial superconducting cable; performing a first eddy current test on the initial superconducting cable; and placing the initial superconducting cable after the first eddy current test in a groove on a side surface of a base material, and fixing the initial superconducting cable after the first eddy current test in the groove through a welding process to obtain the superconducting integrated cable. The method can not only improve a quality of the superconducting integrated cable, but also improve a production efficiency, while reducing a production cost of the superconducting integrated cable, thereby ensuring a quality and a supply of a superconducting magnet.
    Type: Application
    Filed: March 4, 2026
    Publication date: July 9, 2026
    Applicant: MAIKUN (SUZHOU) ENGINEERING TECHNOLOGY CO., LTD
    Inventors: Xuesong LI, Zhi ZHAO, Xingxing ZHOU, Yanyan ZOU, Liyang YE
  • Patent number: 12537121
    Abstract: A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.
    Type: Grant
    Filed: March 14, 2024
    Date of Patent: January 27, 2026
    Assignee: GE PRECISION HEALTHCARE LLC
    Inventors: Jiayin Ling, Longzhi Jiang, Liyang Ye, Stuart Paul Feltham, Thomas Edward Moran, Ernst Wolfgang Stautner
  • Publication number: 20250226135
    Abstract: A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.
    Type: Application
    Filed: March 14, 2024
    Publication date: July 10, 2025
    Inventors: Jiayin Ling, Longzhi Jiang, Liyang Ye, Stuart Paul Feltham, Thomas Edward Moran, Ernst Wolfgang Stautner
  • Patent number: 11961662
    Abstract: A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: April 16, 2024
    Assignee: GE Precision Healthcare LLC
    Inventors: Jiayin Ling, Longzhi Jiang, Liyang Ye, Stuart Paul Feltham, Thomas Edward Moran, Ernst Wolfgang Stautner
  • Publication number: 20220013266
    Abstract: A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.
    Type: Application
    Filed: July 8, 2020
    Publication date: January 13, 2022
    Inventors: Jiayin Ling, Longzhi Jiang, Liyang Ye, Stuart Paul Feltham, Thomas Edward Moran, Ernst Wolfgang Stautner