Abstract: An electrolytic solution for a copper foil, and the preparation and use of an electrolytic copper foil. The electrolytic solution for a copper foil comprises an additive, wherein the additive comprises an inhibitor and an auxiliary agent. The auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate, wherein both the alkyl sulfonate and the alkyl benzene sulfonate have ?12 carbon atoms. By means of simple and convenient chemical regulation and control means such as the selection and combination of additives for an electrolytic (electroplating) solution, a pre-electroplated copper material resulting from electroplating using the electrolytic solution can form a high-proportion annealing twin boundary after a heat treatment at a temperature of ?200° C., and has the unique mechanical characteristic of “annealing-induced strengthening and toughening”.

Abstract: An Fe—Ni—P-RE multicomponent alloy plating layer, electrodeposition preparation method, and plating application. The alloy plating layer obtained via electrodeposition contains elements Fe, Ni, P and RE, with the following mass percentages Fe— 16%-65%, Ni— 25%-70%, combined Fe and Ni— 63%-91%, RE 1.6%-25%, and the balance being P. The plating solution mainly contains the following components: ferrous salt, nickel salt, NaH2PO2, RECl3, H3BO3 and Na3C6H5O7. A multicomponent alloy plating layer of different components can be obtained by adjusting the main salt and complexing agent in the plating solution and by adjusting the process Enabled is controllable adjustment to the components of the obtained plating layer while saving costs, improved characteristics such as the thermal expansion coefficient, electrical property, magnetic property, etc., and products and methods very suitable for applications in the field of micro-electronics.

Abstract: Disclosed are a Fe—Ni—P-RE multicomponent alloy plating layer, and electrodeposition preparation method and application thereof. An alloy plating layer obtained via electrodeposition contains elements of Fe, Ni, P and RE, the mass percentage of Fe being 20%-65%, the mass percentage of Ni being 25%-70%, the combined mass percentage of Fe and Ni being 65%-90%, the mass percentage of RE being 2%-25%, and the balance being P. The plating solution mainly contains the following components: ferrous salt, nickel salt, NaH2PO2, RECl3, H3BO3 and Na3C6H5O7. A multicomponent alloy plating layer of different components can be obtained by adjusting the main salt and complexing agent in the plating solution and by adjusting the process. The present invention realizes controllable adjustment to the components of the obtained plating layer while saving costs, and further improves indexes such as the thermal expansion coefficient, electrical property, magnetic property, etc.