Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: A fabricating method for patterned sapphire substrate is provided. The fabricating method includes the following processes. First, a sapphire substrate is provided, and a mask layer is formed on the sapphire substrate, wherein the mask layer with appropriate pattern exposes a part of the sapphire substrate. Then, a wet etching process is performed to remove the exposed part of the sapphire substrate, wherein an etchant in the wet etching process includes sulfuric acid and the mixture of the sulfuric acid and the phosphoric acid. Next, the mask layer is removed to form the patterned sapphire substrate. Further, a fabricating method for light-emitting diode is provided.