Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: The present invention relates to a method and a kit, a computer-implemented method and a system for in vitro predicting survival time of an individual with bladder cancer after surgery from an individual's biological sample. Expression levels of a target gene combination of in vitro aggressive bladder cancer specimen of a patient are detected, and the target gene combination includes at least two of PPT2, ARMH4, P4HB, SLC1A6 and ARID3A, a fragment, a homologue, a variant and a derivative thereof. Next, the expression levels are respectively compared with the reference expression levels of a reference database, and converted to a risk score sum, thereby predicting an averaged survival time of a patient having aggressive bladder cancer after surgery, and being beneficially applied to a kit and a computer-implemented method for in vitro predicting survival time of patient with most aggressive types of bladder cancer after surgery.

Abstract: In a process of molding and assembling a three-dimensional ornament, a mold having a recess in which is formed an opening is provided. A molding pattern is located inside the opening. A first material fills in the molding pattern to form a plurality of protruded decoration patterns. Then, a second material is charged in the opening and the recess of the mold over the first material to respectively form a projection and a contact wall which together form an embossment. The embossment then is removed from the mold. The embossment then is mounted inside a hollow pen tube in a manner that the projection fits in a sidewall opening of the pen tube and the protruded decoration patterns protrude from the sidewall opening. A sleeve is inserted in the hollow pen tube to urge the contact wall of the embossment against the wall of the hollow pen tube.

Abstract: In a process of molding and assembling a three-dimensional ornament, a mold having a recess in which is formed an opening is provided. A molding pattern is located inside the opening. A first material fills in the molding pattern to form a plurality of protruded decoration patterns. Then, a second material is charged in the opening and the recess of the mold over the first material to respectively form a projection and a contact wall which together form an embossment. The embossment then is removed from the mold. The embossment then is mounted inside a hollow pen tube in a manner that the projection fits in a sidewall opening of the pen tube and the protruded decoration patterns protrude from the sidewall opening. A sleeve is inserted in the hollow pen tube to urge the contact wall of the embossment against the wall of the hollow pen tube.