Abstract: This application prides relates to a foldable support plate, a flexible display module, and a foldable electronic device. In an example, a foldable support plate includes a first support portion, a foldable support portion, and a first transition support portion. When the foldable support plate is folded, the first support portion is in a flat state. The foldable support portion is in a bent state when the foldable support plate is folded. The first transition support portion is connected between the first support portion and the foldable support portion. A bending radian of the first transition support portion is less than a bending radian of the foldable support portion when the foldable support plate is folded.

Abstract: A boot verification method is applied to an electronic device having a secure boot function. An algorithm selection identifier is set in the electronic device to indicate an algorithm used by the electronic device in a boot process, so that on the basis of supporting a plurality of algorithms, the electronic device can select, based on the algorithm selection identifier, a corresponding algorithm to perform boot.

Abstract: The disclosed technology concerns methods, apparatus, and systems for designing and generating networks-on-chip (“NoCs”), as well as to hardware architectures for implementing such NoCs. The disclosed NoCs can be used, for instance, to interconnect cores of a chip multiprocessor (aka a “multi-core processor”). In one example implementation, a wire-based routerless NoC design is disclosed that uses deterministically specified wire loops to connect the cores of the chip multiprocessor. The disclosed technology also comprises network interface architectures for use in an NoC. For example, a core can be equipped with a low-area-cost interface that is deadlock-free, uses buffering sharing, and provides low latency.

Abstract: The disclosed technology concerns methods, apparatus, and systems for designing and generating networks-on-chip (“NoCs”), as well as to hardware architectures for implementing such NoCs. The disclosed NoCs can be used, for instance, to interconnect cores of a chip multiprocessor (aka a “multi-core processor”). In one example implementation, a wire-based routerless NoC design is disclosed that uses deterministically specified wire loops to connect the cores of the chip multiprocessor. The disclosed technology also comprises network interface architectures for use in an NoC. For example, a core can be equipped with a low-area-cost interface that is deadlock-free, uses buffering sharing, and provides low latency.

Abstract: The present invention discloses dry-steamed fine dried noodles. The dry-steamed fine dried noodles with a moisture content of less than or equal to 14.5% are prepared via the processes of dry-steaming, cooling and tempering by using fine dried noodles with a moisture content of 10%-16% as raw material. Compared with the control noodles, the maximum load of the dry-steamed fine dried noodles is improved by 10%-200%, and the cooking loss rate is reduced by 0.5%-1.5%. The dry-steamed fine dried noodles have good taste, boiling fastness, long shelf life, and good edible quality and cooking performance.