Patents by Inventor Lloyd Bernard Stearns, Jr.

Lloyd Bernard Stearns, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7920377
    Abstract: Embodiments include hardware and/or software for manufacturing a removable plate having a medium, to be integral to a casing for a processor-based device. Integrating the removable plate in or on the casing facilitates access to the medium and the data stored on the medium by providing storage in a location that is convenient and local to the processor-based device. The removable plate may include a first surface designed to cover a portion of the processor-based device and a second surface to be covered by the first surface when integrated with the casing, to provide access to the medium. The removable plate may also include any other types of media that can communicatively couple with the processor-based device directly, or indirectly through, e.g., a computer network.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: April 5, 2011
    Assignee: International Business Machines Corporation
    Inventors: Michael Aaron Kaply, Walter Chun-Won Lee, Jonas Sicking, Lloyd Bernard Stearns, Jr.
  • Publication number: 20090040696
    Abstract: Embodiments include hardware and/or software for manufacturing a removable plate having a medium, to be integral to a casing for a processor-based device. Integrating the removable plate in or on the casing facilitates access to the medium and the data stored on the medium by providing storage in a location that is convenient and local to the processor-based device. The removable plate may include a first surface designed to cover a portion of the processor-based device and a second surface to be covered by the first surface when integrated with the casing, to provide access to the medium. The removable plate may also include any other types of media that can communicatively couple with the processor-based device directly, or indirectly through, e.g., a computer network.
    Type: Application
    Filed: October 17, 2008
    Publication date: February 12, 2009
    Applicant: International Business Machines Corporation
    Inventors: Michael Aaron Kaply, Walter Chun-Won Lee, Jonas Sicking, Lloyd Bernard Stearns, JR.
  • Patent number: 7458145
    Abstract: Embodiments include hardware and/or software for manufacturing a removable plate having a medium, to be integral to a casing for a processor-based device. Integrating the removable plate in or on the casing facilitates access to the medium and the data stored on the medium by providing storage in a location that is convenient and local to the processor-based device. The removable plate may include a first surface designed to cover a portion of the processor-based device and a second surface to provide access to the medium. The removable plate may also include any other types of media that can communicatively couple with the processor-based device directly, or indirectly through, e.g., a computer network.
    Type: Grant
    Filed: January 12, 2004
    Date of Patent: December 2, 2008
    Assignee: International Business Machines Corporation
    Inventors: Michael Aaron Kaply, Walter Chun-Won Lee, Jonas Sicking, Lloyd Bernard Stearns, Jr.
  • Patent number: 7375278
    Abstract: Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at least one independent path for transmitting a signal between the components. The pattern of interconnects is then applied to the interior surface, the application being configured for the topography of the interior surface to couple the components with the pattern of interconnects. In many embodiments, the components may then be mounted to the casing and interconnected with the interconnects. And, in some embodiments the pattern of interconnects may be coupled with a circuit board having additional components.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: May 20, 2008
    Assignee: International Business Machines Corporation
    Inventors: Michael Aaron Kaply, Walter Chun-Won Lee, Jonas Sicking, Lloyd Bernard Stearn, Jr.
  • Patent number: 7291783
    Abstract: Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at least one independent path for transmitting a signal between the components. The pattern of interconnects is then applied to the interior surface, the application being configured for the topography of the interior surface to couple the components with the pattern of interconnects. In many embodiments, the components may then be mounted to the casing and interconnected with the interconnects. And, in some embodiment, the pattern of interconnects may be coupled with a circuit board having additional components.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: November 6, 2007
    Assignee: International Business Machines Corporation
    Inventors: Michael Aaron Kaply, Walter Chun-Won Lee, Jonas Sicking, Lloyd Bernard Stearn, Jr.