Abstract: Two components are bonded together in a bonding apparatus using a bonding medium of malleable metallic spheres and a curable adhesive. The two components are bonded by positioning the components in a facing-but-spaced-apart relation in the bonding apparatus with the spheres and the adhesive between the first component and the second component. The bonding apparatus forces the first component toward the second component with sufficient force to bond the spheres to the first component and to the second component, while monitoring at least one measured bonding reaction of the first component and the second component, and controlling the bonding apparatus responsive to the step of monitoring. The adhesive is thereafter cured, optionally with the bonding pressure released and the assembly removed from the bonding apparatus.

Abstract: A method for bonding the ends of the conductors 52 to circuit pads 54 is disclosed whereby the cable 20 is placed over the circuit pads 54; a bonding tool 44 is pressed against an upper surface 58 of the cable 20; the substrate 46 of the cable 20 is compressed beyond its elastic limit; and ultrasonic energy is applied to the bonding tool 44 and transmitted through the substrate 46 to effect a metallic bond between the conductors 52 and circuit pads 54.

Abstract: A first piece (22) is bonded to a second piece (24) at a selected location (45) by positioning the first piece (22) and second piece (24) between a pair of bonding tools (36 and 38), with the bonding tools at the selected location (45) of the first piece (22) and the second piece (24) where bonding is to be achieved. The selected location (45) of the first piece (22) and the second piece (24) is pressed between the pair of bonding tools (36 and 38) with an applied force (46), the applied force (46) increasing from zero to a prebonding force (64), being maintained at the prebonding force (64) for a prebonding period (66), changing to a bonding force (60), and thereafter decreasing from the bonding force (60) to zero.

Abstract: A thin film electrical cable 20 is disclosed having a polyimide substrate 46, a layer of titanium 48 on a lower side 50 of the substrate 46, and a plurality of gold conductors 52 on the titanium 48. The thin layers of titanium and gold are preferably sequentially deposited on a clean polyimide film by sputtering. Additional gold is electroplated and separate conductors are delineated. The use of organic adhesive materials to attach the conductors 52 to the substrate 46 is avoided.

Abstract: A dynamic force measurement system for taking a series of force measurements of a force applied against a sensor device whereby to determine, record, display and store the sequence of force measurements. The sensor device is adapted to respond to said force and provide an electronic force signal which is representative thereof. The dynamic force measurement system includes a central processing unit for operating a computer program, having data and program instruction storage means, graphic display and user interface means. A sensor interface device provides for the connecting of the sensor device to the central processing unit. The sensor interface device includes means for monitoring the force signal generated by the sensor device, converting the signal to a numerical binary format for recording in intermediate storage means within the sensor interface device for ultimate transfer to the central processing unit for display, statistical analysis and storage.

Abstract: A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support station adapted to support a work piece observable through a microscope viewing arrangement, and a bonding head having a support arm on which is mounted a bonding tool and selectively movable wire clamping arms adapted to incrementally feed a bonding wire to the bonding tool. The support arm is caused to undergo a ramped movement so as to effect a predetermined progressively increasing contact force between the bonding tool and the work piece. In one embodiment, the clamping arms are adapted for cooperation with actuator means so as to effect incremental stepped arcuate movement of clamping fingers along the path traversed by the conductor wire whereby to lineraly advance the bonding wire when gripped by the clamping fingers.

Abstract: A method and device for providing point of contact light or target on a work piece are provided which are particularly adapted for use with a wire bonder independent of the operator's viewing aid and which employ a high intensity light source to create a naturally colored beam of light. In accordance with one embodiment of the invention, a helium-neon laser beam is expanded and then formed into a point of light which is projected onto the work piece surface by an adjustable mirror arrangement which is positioned to reflect the specular component of the beam away from the operator's viewing sight line and which enables easy focusing and adjustment of the target spot so as to substantially reduce parallax.