Patents by Inventor Lloyd Jack Goodman

Lloyd Jack Goodman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink with a heat pipe for spreading of heat
    Patent number: 6189601
    Abstract: The invention provides a heat sink for cooling and electronic device. The heat sink includes a member, and a heat pipe secured to the member. The member has a first portion, a second portion, and a plurality of fins on the second portion. The heat pipe has a first, evaporator section and a second, condenser section. The first section is located at the first portion so that heat can be transferred thereto from a heat generating component of the electronic device. The second section is located at the second portion so that heat can be transferred therefrom to the second portion.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: February 20, 2001
    Assignee: Intel Corporation
    Inventors: Lloyd Jack Goodman, Chai-Pin Chiu, Abhay W. Watwe, Ram Viswanath