Abstract: A skin compatible component attachable to mammalian skin. The component is formed as a silicone matrix comprising a polyorganosiloxane derived silicone polymer and a moisture control particulate and permeability modifying polymer distributed within the polymer network. The skin compatible component may be utilised as an ostomy wafer or flange to secure an ostomy appliance to the skin and in particular peri-stomal skin.

Abstract: A skin compatible component attachable to mammalian skin. The component is formed as a silicone matrix comprising a polyorganosiloxane derived silicone polymer and moisture control particulate distributed within the polymer network being configured to absorb moisture from the skin. The skin compatible component may be utilised as an ostomy wafer or flange to secure an ostomy appliance to the skin and in particular peri-skin.

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract: A method of real time dynamic CD control in a system for heat-treating resist coated wafers on a hotplate. The method includes establishing a temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones, and sequentially heat-treating the resist coated wafers on the hotplate. The method further includes obtaining CD metrology data from test areas on the heat-treated wafers, where different groups of test areas are selected for two or more of the heat-treated wafers. A CD metrology data map is constructed using the CD metrology data and an adjusted temperature profile is established for the hotplate surface using the CD metrology data. Additional wafers are then heat-treated on the hotplate. The method also may be applied to heat-treating resist coated wafers on a plurality of hotplates.

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract: The invention is an apparatus and method for distributing a surface to facilitate the display of objects. By utilizing an aesthetically pleasing multifunctional swivel device, with various detachable extensions and surfaces, which are also interchangeable and may be rearranged in order to distribute a flat functional surface within a more condensed vertical space, food items and beverages may be organized and displayed buffet-style at social gatherings.

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract: A method of real time dynamic CD control in a system for heat-treating resist coated wafers on a hotplate. The method includes establishing a temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones, and sequentially heat-treating the resist coated wafers on the hotplate. The method further includes obtaining CD metrology data from test areas on the heat-treated wafers, where different groups of test areas are selected for two or more of the heat-treated wafers. A CD metrology data map is constructed using the CD metrology data and an adjusted temperature profile is established for the hotplate surface using the CD metrology data. Additional wafers are then heat-treated on the hotplate. The method also may be applied to heat-treating resist coated wafers on a plurality of hotplates.

Abstract: An after develop inspection tool considers tool-to-tool variability when determining confidence score for wafers under inspection. A golden wafer is used to calculate a RGB signature as well as the slope of the individual RGB curves for different lamp intensities. These slopes are normalized in order to generate a compensation factor for red values and blue values within a signature. When a wafer is subsequently inspected at an ADI station using a different lamp, the test wafer RGB signature is likely captured at a different lamp intensity. Consequently, when comparing the signatures, the golden wafer RGB signature is adjusted by the compensation factors, based on the different lamp's intensity setting, and this adjusted RGB signature is then used to determine whether a defect exists on the test wafer.

Abstract: Method for hollowing out an article of food such as a fruit or vegetable so that a shell of substantially uniform predetermined thickness is formed. A rotating knife is rotated about its axis, while an end area of an article of food is guided with a curved guide member against the rotating knife. The guide member loosely supports the food for rotation and translation about its longitudinal axis while maintaining the knife a predetermined distance from the surface of the food. The distance between the guide and the blade is adjustable to control the thickness of the shell.