Abstract: Tolyltriazole derived esters of tri, tetra, and poly carboxylic acids or an acid generating compound have been found to be effective lubricity additives for lube oils, greases, or distillate fuels.

Abstract: Tolyltriazole derived esters of tri, tetra, and poly carboxylic acids or an acid generating compound have been found to be effective lubricity additives for lube oils, greases, or distillate fuels.

Abstract: The invention relates to lubricant and fuel additives having antiwear and friction reducing properties. The invention also relates to compositions of oils with viscosities appropriate for lubricants, greases produced therefrom, and fuels and methods for making these compositions. Described in this invention are products of nitrogen heterocycles, such as benzotriazole and tolyltriazole, with amines, such as alkyl amines, aliphatic diamines, alicyclic amines, heterocyclic amines, propylene amines, and aliphatic etheramines, that are linked using carbonyl compounds (e.g., aldehyde, ketone or glyoxal). Additionally, products generated by the reaction of carboxylic acids or carboxylic acid generating compounds (e.g., salts or esters) with carbonyl (e.g., aldehyde, ketone or glyoxal) coupled nitrogen heterocycles and amines, including those described above, are also included in this invention. These products can be used in fuels and lubricants to produce improved antiwear and friction reducing properties.

Abstract: A combination of Mannich type reaction products of ethoxylated alkylated phenol, and alkylated arylamine possess excellent antioxidant properties. The presence of alkylated phenol in the structure is believed to provide a synergistic antioxidant activity with the aromatic amine. Presence of the alkylated aromatic moiety is believed to provide enhanced lubricant solubility compared to unalkylated diphenylamine type antioxidants. Application of these synergistic mixtures of additives and synthetic base stocks in premium automotive and industrial lubricants will significantly enhance stability and extend service life.

Abstract: Heat pipe technology may be utilized to cool circuit card-mounted electronic components. A heat pipe thermal mounting pipe has a very high thermal conductivity and provides a relatively uniform temperature surface for attaching of circuit card-mounted electronic components. It comprises thin evaporator and condenser wicks (for low temperature gradients) as well as a relatively porous sintered metal artery wick (for high heat transfer capability). The heat sink or other heat exchanger may be mounted at the edge of the thermal mounting plate in the vicinity of the condenser wick. The electronic components are mounted in the vicinity of the evaporator wicks.

Abstract: A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.

Abstract: A method for packaging glass jars by arranging the jars in nested engagement in staggered rows in a wrap-around fiberboard carton. By utilizing corrugated fiberboard with the corrugations extending at an angle to the score lines formed in the carton blank, consistency of carton dimensions is insured. The use of a film-type overwrap shrunken onto each jar minimizes any adverse effect caused by breakage and provides a surface for imprintation.

Abstract: A micro-electronic package which is capable of operating with power densities extending at least to 10 kilowatts per square centimeter comprises a sealed enclosure coupled to an external heat sink and electronic devices and circuitry within the enclosure. Electrical leads extend from the electronic devices and circuitry to the outside of the enclosure to couple the devices and circuitry into a larger electrical function. A dielectric powder is adhered as a complete and conformal coating substantially to all interior surfaces of the enclosure and to all exposed surfaces of the electronic devices and circuitry, and functions as a heat pipe wick. A dielectric working fluid within the enclosure, therefore, can intimately contact all the interior and exposed surfaces to minimize the occurrence of local hot spots on the electronic devices and circuitry and to maximize heat transfer therefrom to the external heat sink.