Patents by Inventor Lloyd Pollard, II

Lloyd Pollard, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transient cooling augmentation for electronic components
    Patent number: 6260613
    Abstract: An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in an isothermal process utilizing the latent heat of the material. The isothermal process allows the two-phase material to absorb heat generated by the integrated circuit without raising the temperature of the assembly.
    Type: Grant
    Filed: January 5, 1999
    Date of Patent: July 17, 2001
    Assignee: Intel Corporation
    Inventor: Lloyd Pollard, II
  • Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly
    Patent number: 6154365
    Abstract: An electrical assembly which includes a heat sink that is pressed into an integrated circuit package by a spring fixture. The integrated circuit package is mounted to a substrate. Inserted through the spring fixture is a screw. The screw is also inserted through a clearance hole of the substrate and into an attachment hole of the heat sink to attach the heat sink to the substrate. Other features are disclosed.
    Type: Grant
    Filed: February 26, 1999
    Date of Patent: November 28, 2000
    Assignee: Intel Corporation
    Inventors: Lloyd Pollard, II, Chia-Pin Chiu