Abstract: In a device for measuring a fill level of a liquid in a container with an ultrasonic sensor, wherein the ultrasonic sensor is arranged at the bottom end of a damping cup with a measuring tube, wherein the top area of the measuring tube has at least one inner ventilation hole and a cover assigned to the inner ventilation hole, which cover surrounds at least the upper end area of the measuring tube and itself has at least one outer ventilation hole, wherein at least one screen is present in the cover and is in contact with the cover at the top, it is provided that the screen which is in contact with the cover at the top extends horizontally from the measuring tube as far as a side wall of the cover. In addition at least four screens are provided between the one or more inner ventilation holes and the one or more outer ventilation holes, so that at least two air bubbles are trapped in the region of the screen when the device is in operation.

Abstract: In a device for measuring a fill level of a liquid in a reservoir with an ultrasonic sensor, wherein the ultrasonic sensor is arranged at the bottom end of a damping cup with a measuring tube, wherein electronic components are assigned to the ultrasonic sensor, the electronic components are encapsulated in sealing manner against the liquid that is to be measured between a floor of an electronics installation space and a cover arranged above the floor, so that the electronics installation space forms and encapsulated area. At least one support is provided inside the electronics installation space and connects the cover in force-fitting manner with the electronics installation space.

Abstract: In an electronic component with a component housing and an integrated circuit with sensor function which is accommodated in a plastic electronic housing, wherein the component housing has a cutaway in the region of the circuit with sensor function so that the integrated circuit can perform its function as a sensor through the cutaways, the component housing lies flush with the edge of the cutaway on the electronic housing and is joined in sealing manner with an adhesive bond to the electronic housing. The component housing has an approximately vertical section on the edge of the cutaways, which section extends along the side of the electronic housing. A horizontal section is also present and projects horizontally over the electronic housing.