Patents by Inventor lnwon O

lnwon O has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
    Publication number: 20200373243
    Abstract: A semiconductor package includes a mold substrate, at least one semiconductor chip disposed in the mold substrate and including chip pads, and a redistribution wiring layer covering a first surface of the mold substrate and including a first redistribution wiring and a second redistribution wiring stacked in at least two levels to be electrically connected to the chip pads. The first redistribution wiring includes a signal line extending in a first region, and the second redistribution wiring includes a ground line in a second region overlapping with the first region. The ground line has a plurality of through holes of polygonal column shapes.
    Type: Application
    Filed: November 1, 2019
    Publication date: November 26, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jaegwon JANG, lnwon O, Jongyoun KIM, Seokhyun LEE, Yeonho JANG