Abstract: Disclosed are bump structures and bump structure fabrication methods. A bump structure including a pad and a bump on a top surface of the pad may be provided. The bump may include an upper bump portion and the lower bump portion, and the lower bump portion may include a pedestal portion in contact with the top surface of the pad and a pillar portion upwardly extending from the pedestal portion. A cross-sectional area of at least a portion of the pedestal portion along a first direction may be greater than a cross-sectional area of the pillar portion along the first direction.

Abstract: An electronic device and a method of operating an electronic device are provided. The electronic device includes a housing including a first face and a second face that faces in a direction opposite to the first face; a display exposed through the first face of the housing; a ground member disposed between the first face and the second face; an antenna radiator at least partially disposed within the housing and/or on a portion of the housing; a communication circuit electrically connected to the antenna radiator; a conductive member disposed within the housing or forming a portion of the second face of the housing; and a control circuit electrically connected to the ground member and the conductive member, wherein the control circuit is configured to selectively connect the conductive member to the ground member if the antenna radiator and the communication circuit are electrically connected to each other.