Patents by Inventor Loïc Sanchez

Loïc Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
    Publication number: 20230207515
    Abstract: A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere including nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method including: placing into contact the first surface with an aqueous solution including at least 90% water, for a contacting duration longer than or equal to 30 minutes; and then drying the first surface.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 29, 2023
    Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives
    Inventors: Frank Fournel, Christophe Morales, Loïc Sanchez, Brigitte Montmayeul
  • Method for producing at least one pad assembly on a support for the self-assembly of an integrated circuit chip on the support by the formation of a fluorinated material surrounding the pad and exposure of the pad and the fluorinated material to an ultraviolet treatment in the presence of ozone
    Patent number: 9240389
    Abstract: A method for producing at least one pad assembly (32, 50) on a support (19, 43) for use in a method for self-assembling at least one element (10) on the support (19, 43), comprises fanning, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of the pad assembly (32, 50), the layer (28, 48) having a thickness greater than 10 nm. The layer (28, 48) and the location (30, 44) are exposed to an ultraviolet treatment in the presence of ozone to form the pad assembly (32, 50) at said location (30, 44), wherein a drop of liquid (16) having a static contact angle on the pad assembly (32, 50) less than or equal to 15°, after the exposure to the ultraviolet treatment, has a static contact angle on the layer (28, 48) greater than or equal to 100°.
    Type: Grant
    Filed: March 20, 2013
    Date of Patent: January 19, 2016
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, STMICROELECTRONICS (CROLLES2) SAS
    Inventors: Léa Di Cioccio, Sébastien Mermoz, Loïc Sanchez
  • METHOD FOR PRODUCING AT LEAST ONE PAD ASSEMBLY ON A SUPPORT FOR THE SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT BY THE FORMATION OF A FLUORINATED MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND THE FLUORINATED MATERIAL TO AN ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE
    Publication number: 20150287695
    Abstract: A method for producing at least one pad assembly (32, 50) on a support (19, 43) for use in a method for self-assembling at least one element (10) on the support (19, 43), comprises fanning, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of the pad assembly (32, 50), the layer (28, 48) having a thickness greater than 10 nm. The layer (28, 48) and the location (30, 44) are exposed to an ultraviolet treatment in the presence of ozone to form the pad assembly (32, 50) at said location (30, 44), wherein a drop of liquid (16) having a static contact angle on the pad assembly (32, 50) less than or equal to 15°, after the exposure to the ultraviolet treatment, has a static contact angle on the layer (28, 48) greater than or equal to 100°.
    Type: Application
    Filed: March 20, 2013
    Publication date: October 8, 2015
    Inventors: Léa Di Cioccio, Sébastien Mermoz, Loïc Sanchez
  • Method and device for monitoring a heat treatment of a microtechnological substrate
    Patent number: 7846749
    Abstract: A method of monitoring a heat treatment of a microtechnological substrate includes placement of the substrate to be treated in a heating zone and applying a heat treatment to the substrate, under predetermined temperature conditions, while monitoring the change over the course of time in the vibratory state of the substrate, and detecting a fracture in the substrate by detecting a peak characteristic in the vibratory state over the course of time.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: December 7, 2010
    Assignee: Commissariat a l'Energie Atomique
    Inventor: Loïc Sanchez
  • METHOD AND DEVICE FOR MONITORING A HEAT TREATMENT OF A MICROTECHNOLOGICAL SUBSTRATE
    Publication number: 20100015733
    Abstract: A method of monitoring a heat treatment of a microtechnological substrate includes placement of the substrate to be treated in a heating zone and applying a heat treatment to the substrate, under predetermined temperature conditions, while monitoring the change over the course of time in the vibratory state of the substrate, and detecting a fracture in the substrate by detecting a peak characteristic in the vibratory state over the course of time.
    Type: Application
    Filed: June 11, 2007
    Publication date: January 21, 2010
    Inventor: Loïc Sanchez