Abstract: An apparatus and method for making high-speed wire bonds between a semiconductor chip and a chip carrier. A chuck supported on a pushrod passing through a rotating sleeve holds the chip and provides Z- and theta- motions, while the bonding head provides X- and Y- movements relative to the chip. Limiting the bonding head to X- and Y- motions significantly reduces the dynamic forces on the bonding head and supporting mechanism, thereby enabling a faster rate of reliable operation. A signal source directly contacts the pushrod to provide reference signals to control circuitry regarding the position of the anvil and chip supported thereon.

Abstract: A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.