Abstract: Apparatus and method for determining if a lead bond created by an ultrasonic transducer has the characteristics of a good bond. The current supplied to the transducer is monitored and the envelope of the supplied current is sampled periodically and supplied to a computing means. The computing compares selected characteristics of the sampled signal with characteristics previously determined to create good lead bonding. The results of this comparison are stored in a bond quality control data processing system and supplied to a host data processing system. The host data processing system can take appropriate action. The bond quality control data processing system can control the power supplied to the ultrasonic transducer to provide better characteristics.

Abstract: A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.