Patents by Inventor Loan Nguyen
Loan Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9580577Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.Type: GrantFiled: March 2, 2011Date of Patent: February 28, 2017Assignee: HUNTSMAN INTERNATIONAL LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 9512333Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, molded articles, adhesives and coatings.Type: GrantFiled: April 18, 2013Date of Patent: December 6, 2016Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 9416271Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: GrantFiled: January 27, 2015Date of Patent: August 16, 2016Assignee: HUNTSMAN ADVANCED MATERIALS AMERICAS LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20150147508Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: ApplicationFiled: January 27, 2015Publication date: May 28, 2015Inventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 8975318Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: GrantFiled: February 20, 2009Date of Patent: March 10, 2015Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 8853302Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.Type: GrantFiled: May 14, 2010Date of Patent: October 7, 2014Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
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Publication number: 20140057086Abstract: The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.Type: ApplicationFiled: May 9, 2012Publication date: February 27, 2014Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20130231021Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.Type: ApplicationFiled: April 18, 2013Publication date: September 5, 2013Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Patent number: 8445699Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.Type: GrantFiled: March 16, 2010Date of Patent: May 21, 2013Assignee: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20120318571Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.Type: ApplicationFiled: March 2, 2011Publication date: December 20, 2012Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20120046388Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.Type: ApplicationFiled: May 14, 2010Publication date: February 23, 2012Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
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Publication number: 20120003892Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.Type: ApplicationFiled: March 16, 2010Publication date: January 5, 2012Applicant: Huntsman Advanced Materials Americans LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20100330287Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.Type: ApplicationFiled: February 20, 2009Publication date: December 30, 2010Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20100264789Abstract: Spa apparatuses are provided. In this regard, a representative spa apparatus, among others, includes a basin structure and housing. The housing has an outer surface that has a partial oval shape and an opening that is located in front of the housing and designed to contain a chair. The housing is coupled to the basin structure at a bottom portion of the housing.Type: ApplicationFiled: April 20, 2009Publication date: October 21, 2010Inventors: Quy That Ton, Loan Nguyen
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Patent number: 6820121Abstract: Embodiments of the present invention include methods, systems and computer program products which provide for processing an event having a classification based on associated policy rules where the policy rules are conditioned on the classification. A policy rules hash table is provided including a plurality of policy rule entries, each policy rule entry being associated with a hash index. A hash index is generated using a classification hash length based on the classification of the event, the classification having an associated length at least equal to the classification hash length. A policy rule entry in the policy rules hash table is identified that corresponds to the generated hash index. It is determined if a classification field length associated with the identified policy rule corresponds to the classification hash length. The identified policy rule entry is executed if the hash length associated with the identified policy rule corresponds to the classification hash length.Type: GrantFiled: August 24, 2000Date of Patent: November 16, 2004Assignee: International Business Machines CorporationInventors: Gregory M. Callis, Jon Kevin Franks, Lap Thiet Huynh, Loan Nguyen, Diane Iupe Shannon, David Yu Pin Yang
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Patent number: 6662235Abstract: Embodiments of the present invention include methods, systems and computer program products which provide for a complex policy rule structured in a plurality of levels wherein the complex policy rule selects an action for execution based on a plurality of individual policy conditions. An event is received having an associated value defining a point in a space covered by the individual policy conditions. The following operations are performed if the complex policy rule is a CNF policy rule. A plurality of summary conditions are generated, each of the summary conditions being associated with one of the levels. The associated value of the received event is compared to a selected one of the summary conditions to determine if the selected one of the summary conditions is met.Type: GrantFiled: August 24, 2000Date of Patent: December 9, 2003Assignee: International Business Machines CorporationInventors: Gregory M. Callis, Jon Kevin Franks, Lap Thiet Huynh, Loan Nguyen, Diane Iupe Shannon, David Yu Pin Yang