Patents by Inventor Loan Nguyen

Loan Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9580577
    Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: February 28, 2017
    Assignee: HUNTSMAN INTERNATIONAL LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Patent number: 9512333
    Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, molded articles, adhesives and coatings.
    Type: Grant
    Filed: April 18, 2013
    Date of Patent: December 6, 2016
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Patent number: 9416271
    Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
    Type: Grant
    Filed: January 27, 2015
    Date of Patent: August 16, 2016
    Assignee: HUNTSMAN ADVANCED MATERIALS AMERICAS LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20150147508
    Abstract: A method for forming a halogen-free curable composition containing a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
    Type: Application
    Filed: January 27, 2015
    Publication date: May 28, 2015
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Patent number: 8975318
    Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: March 10, 2015
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Patent number: 8853302
    Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: October 7, 2014
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
  • Publication number: 20140057086
    Abstract: The present disclosure provides a thermosetting resin composition including a polymaleimide prepolymer and a poly(arylene ether) prepolymer characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards, semiconductor devices and radome composites for aerospace applications.
    Type: Application
    Filed: May 9, 2012
    Publication date: February 27, 2014
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20130231021
    Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.
    Type: Application
    Filed: April 18, 2013
    Publication date: September 5, 2013
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Patent number: 8445699
    Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: May 21, 2013
    Assignee: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20120318571
    Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.
    Type: Application
    Filed: March 2, 2011
    Publication date: December 20, 2012
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20120046388
    Abstract: The present invention provides a liquid resin system including a liquid monobenzoxazine monomer and a non-glycidyl epoxy compound, wherein the weight ratio of the monobenzoxazine monomer to the non-glycidyl epoxy compound is in a range of about 25:75 to about 60:40. The liquid resin system exhibits a low viscosity and exceptional stability over an extended period of time making its use in a variety of composite manufacturing methods highly advantageous.
    Type: Application
    Filed: May 14, 2010
    Publication date: February 23, 2012
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen, Mark Bryant
  • Publication number: 20120003892
    Abstract: The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings.
    Type: Application
    Filed: March 16, 2010
    Publication date: January 5, 2012
    Applicant: Huntsman Advanced Materials Americans LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20100330287
    Abstract: The present invention provides a halogen-free curable composition including a benzoxazine monomer, at least one epoxy resin, a catalyst, a toughening agent and a solvent. The halogen-free curable composition is especially suited for use in automobile and aerospace applications since the composition, upon curing, produces a composite having a high glass transition temperature.
    Type: Application
    Filed: February 20, 2009
    Publication date: December 30, 2010
    Applicant: Huntsman Advanced Materials Americas LLC
    Inventors: Roger Tietze, Yen-Loan Nguyen
  • Publication number: 20100264789
    Abstract: Spa apparatuses are provided. In this regard, a representative spa apparatus, among others, includes a basin structure and housing. The housing has an outer surface that has a partial oval shape and an opening that is located in front of the housing and designed to contain a chair. The housing is coupled to the basin structure at a bottom portion of the housing.
    Type: Application
    Filed: April 20, 2009
    Publication date: October 21, 2010
    Inventors: Quy That Ton, Loan Nguyen
  • Patent number: 6820121
    Abstract: Embodiments of the present invention include methods, systems and computer program products which provide for processing an event having a classification based on associated policy rules where the policy rules are conditioned on the classification. A policy rules hash table is provided including a plurality of policy rule entries, each policy rule entry being associated with a hash index. A hash index is generated using a classification hash length based on the classification of the event, the classification having an associated length at least equal to the classification hash length. A policy rule entry in the policy rules hash table is identified that corresponds to the generated hash index. It is determined if a classification field length associated with the identified policy rule corresponds to the classification hash length. The identified policy rule entry is executed if the hash length associated with the identified policy rule corresponds to the classification hash length.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: November 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Gregory M. Callis, Jon Kevin Franks, Lap Thiet Huynh, Loan Nguyen, Diane Iupe Shannon, David Yu Pin Yang
  • Patent number: 6662235
    Abstract: Embodiments of the present invention include methods, systems and computer program products which provide for a complex policy rule structured in a plurality of levels wherein the complex policy rule selects an action for execution based on a plurality of individual policy conditions. An event is received having an associated value defining a point in a space covered by the individual policy conditions. The following operations are performed if the complex policy rule is a CNF policy rule. A plurality of summary conditions are generated, each of the summary conditions being associated with one of the levels. The associated value of the received event is compared to a selected one of the summary conditions to determine if the selected one of the summary conditions is met.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: December 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: Gregory M. Callis, Jon Kevin Franks, Lap Thiet Huynh, Loan Nguyen, Diane Iupe Shannon, David Yu Pin Yang