Patents by Inventor Logan A. Loeb

Logan A. Loeb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220007500
    Abstract: A phased antenna array includes at least one antenna element individually fabricated via one or more individual antenna element fabrication processes and a printed circuit board (PCB) fabricated via one or more PCB fabrication processes, where the at least one antenna element is coupled to the PCB via one or more post-fabrication processes. The at least one antenna element includes a first antenna element metal layer, a second antenna element metal layer, an antenna element dielectric layer positioned between the first antenna element metal layer and the second antenna element metal layer and being of a greater thickness than a thickness of at least one of the first antenna element metal layer or the second antenna element metal layer, and one or more antenna element plated vias embedded within the antenna element dielectric layer and coupled to the first antenna element metal layer and the second antenna element metal layer.
    Type: Application
    Filed: October 8, 2019
    Publication date: January 6, 2022
    Inventor: Logan A. Loeb
  • Patent number: 10879582
    Abstract: A device and method of fabrication of a dielectrically reinforced formed metal antenna element enables an easily replaceable antenna element unlimited by PCB thickness constraints and planar structures. Modern fabrication methods are employed to embed pre-formed metal antenna structures in a rigid dielectric material. Conductive elastomer contacts provide electrical contact between an RF distribution PCB and the antenna element structures. A single layer of the dielectrically reinforced formed metal antenna elements may offer a simple yet effective antenna element capable of excellent RF connectivity up to 20 GHz. The individual elements are conformal to an installation, cooperative with additional elements, and easily replaceable with molded couplings attachable to the PCB with the flexible elastomers ensuring connectivity.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: December 29, 2020
    Assignee: Rockwell Collins, Inc.
    Inventor: Logan A. Loeb
  • Patent number: 9621259
    Abstract: A method and system for providing configuration parameters to TDMA nodes are disclosed. The configuration parameters are repeatedly transmitted to the TDMA nodes in a predetermined fashion, allowing existing nodes to receive the up-to-date configuration parameters from messages being broadcast in the TDMA network. Any new node joining the TDMA network may also receive the up-to-date configuration parameters, allowing the new node to apply such parameters accordingly and join the network as applicable.
    Type: Grant
    Filed: May 18, 2012
    Date of Patent: April 11, 2017
    Assignee: Rockwell Collins, Inc.
    Inventors: David W. Phillips, James H. Sabin, Kevin M. Bayer, Gary V. Barnette, Steven V. Schatz, Logan A. Loeb
  • Publication number: 20130308624
    Abstract: A method and system for providing configuration parameters to TDMA nodes are disclosed. The configuration parameters are repeatedly transmitted to the TDMA nodes in a predetermined fashion, allowing existing nodes to receive the up-to-date configuration parameters from messages being broadcast in the TDMA network. Any new node joining the TDMA network may also receive the up-to-date configuration parameters, allowing the new node to apply such parameters accordingly and join the network as applicable.
    Type: Application
    Filed: May 18, 2012
    Publication date: November 21, 2013
    Applicant: ROCKWELL COLLINS, INC.
    Inventors: David W. Phillips, James H. Sabin, Kevin M. Bayer, Gary V. Barnette, Steven V. Schatz, Logan A. Loeb